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반도체 패키징용 에폭시 소재 기술

by 전현애(Hyun Aee Chun), 탁상용(Sang Yong Tak), 김윤주(Yun Ju Kim), 박수진(Su Jin Park), 박숙연(Sook Yeon Park), 강경남(Kyung Nam Kang), 박성환(Sung Hwan Park)
Published in 고분자 과학과 기술 (2013)
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