Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming
Guo, Ming-hai, Liu, Jun-you, Jia, Cheng-chang, Jia, Qi-jin, Guo, Shi-ju
Published in Journal of Central South University (01.11.2014)
Published in Journal of Central South University (01.11.2014)
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