Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn−9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
Zhao, Guo-ji, Wen, Guang-hua, Sheng, Guang-min, Jing, Yan-xia
Published in Journal of Central South University (01.08.2016)
Published in Journal of Central South University (01.08.2016)
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