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Search Results - "王辰伟"
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工艺参数对阻挡层CMP后互连线厚度一致性的影响
by
王海英
,
王辰伟
,
刘玉岭
,
赵红东
Published in
电子元件与材料
(2023)
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不同表面活性剂对浅沟槽隔离CMP中SiO2与Si3N4速率选择性的影响
by
张月
,
周建伟
,
王辰伟
,
郭峰
Published in
电子元件与材料
(2023)
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咪唑对钴互连化学机械抛光的影响
by
郭峰
,
王胜利
,
王辰伟
,
张月
Published in
电子元件与材料
(2023)
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聚丙烯酸对氧化铈抛光液稳定性能的影响研究
by
张国林
,
王胜利
,
罗翀
,
王辰伟
,
刘德正
Published in
电子元件与材料
(2023)
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超滤和活性剂协同作用对铜阻挡层CMP后缺陷的控制机理研究
by
崔志慧
,
王辰伟
,
刘玉岭
,
赵红东
,
续晨
Published in
电子元件与材料
(2022)
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新型抑制剂对铜膜CMP后碟形坑与蚀坑的影响
by
李子豪
,
周建伟
,
王辰伟
,
马慧萍
,
张月
Published in
电子元件与材料
(2022)
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不同表面活性剂对铜互连阻挡层CMP一致性的影响
by
魏艺璇
,
王辰伟
,
刘玉岭
,
赵红东
Published in
电子元件与材料
(2022)
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钌基阻挡层铜膜CMP中E1310P的缓蚀机理研究
by
孙纪元
,
周建伟
,
罗翀
,
王辰伟
,
李丁杰
Published in
电子元件与材料
(2023)
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咪唑提升硅片CMP速率的机理研究
by
刘德正
,
周建伟
,
罗翀
,
王辰伟
,
李丁杰
Published in
电子元件与材料
(2023)
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酸性层间介质CMP抛光液胶体稳定性的研究
by
陈志博
,
王辰伟
,
王雪洁
,
王海英
,
盛媛慧
Published in
电子元件与材料
(2023)
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哌嗪对硅衬底CMP速率影响的机理
by
刘文博
,
罗翀
,
王辰伟
,
岳泽昊
,
栾晓东
,
邵祥清
,
李瑾
Published in
微纳电子技术
(2025)
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抛光液添加剂协同作用对铜互连阻挡层CMP后碟形坑及蚀坑的影响
by
崔志慧
,
王辰伟
,
刘玉岭
,
赵红东
,
李红亮
Published in
电子元件与材料
(2021)
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低浓度CeO2/SiO2复合磨料对硅片CMP性能的影响
by
刘文博
,
王辰伟
,
罗翀
,
岳泽昊
,
王雪洁
,
邵祥清
,
李瑾
Published in
电子元件与材料
(2024)
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A new cleaning process for the metallic contaminants on a post-CMP wafer's surface
by
高宝红 刘玉岭
王辰伟
朱亚东
Published in
Journal of semiconductors
(2010)
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Slurry components of TiO2 thin film in chemical mechanical polishing
by
段波 周建
伟
刘玉岭
王辰伟
张玉峰
Published in
半导体学报:英文版
(01.10.2014)
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Investigation on surface roughness in chemical mechanical polishing of TiO2 thin film
by
段波 周建
伟
刘玉岭
王辰伟
张玉峰
Published in
半导体学报:英文版
(01.06.2014)
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Synergetic effect of chelating agent and nonionic surfactant for benzotriazole removal on post Cu-CMP cleaning
by
李彦磊 刘玉岭
王辰伟
李月
Published in
Journal of semiconductors
(01.08.2016)
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Influence of oxidant passivation on controlling dishing in alkaline chemical mechanical planarization
by
贾少华 刘玉岭
王辰伟
闫辰奇
Published in
Journal of semiconductors
(01.12.2015)
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Mechanism analysis of the affect the copper line surface roughness after FA/O alkaline barrier CMP
by
高娇娇 刘玉岭
王辰伟
崔晋
Published in
Journal of semiconductors
(01.12.2014)
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Non-ionic surfactant on particles removal in post-CMP cleaning
by
孙铭斌 高宝红
王辰伟
苗英新 段波 檀柏梅
Published in
Journal of semiconductors
(01.02.2015)
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