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Effects of pattern characteristics on the copper electroplating processt

by 阮文彪陈岚李志刚叶甜春马天宇王强
Published in 半导体学报 (2011)

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Journal Article

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An electroplating topography model based on layout-dependent variation of copper deposition rate

by 王强陈岚李志刚阮文彪
Published in Journal of semiconductors (01.10.2011)

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Journal Article