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"河野, 賢哉"
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"河野, 賢哉"
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高温保持後のSn-3.0Ag-0.5Cuはんだ接合部の疲労寿命評価
by
河野
,
賢哉
,
中, 康弘
,
谷江, 尚史
,
木本, 良輔
,
山本, 健一
Published in
日本機械学会論文集A編
(2012)
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電子部品の微細はんだ接続強度に及ぼす垂直応力の影響
by
土居, 博昭
,
初田, 俊雄
,
河野
,
賢哉
,
菊地, 広
Published in
日本機械学会論文集 A編
(2002)
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Influence of Normal Stress on Micro Solder Joint Strength in Electronic Components
by
DOI, Hiroaki
,
HATSUDA, Toshio
,
KAWANO, Kenya
,
KIKUCHI, Hiroshi
Published in
Transactions of the Japan Society of Mechanical Engineers Series A
(2002)
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engineering
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ball limiting metallurgy
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creep
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ductile fracture
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