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Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate
Lu, Bin, Li, Hui, Wang, Juan-hui, Zhu, Hua-wei, Jiao, Xian-he
Published in Journal of Central South University of Technology. Science & technology of mining and metallurgy (01.06.2008)
Published in Journal of Central South University of Technology. Science & technology of mining and metallurgy (01.06.2008)
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Journal Article