Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
Imakiire, Akihiro, Kozako, Masahiro, Hikita, Masayuki, Tatsumi, Kohei, Inagaki, Masakazu, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji, 明大, 今給黎, 雅裕, 小迫, 政幸, 匹田, 巽 宏平, 雅一, 稲垣, 智徳, 飯塚, 信明, 佐藤, 孝司, 清水, 和敏, 上田, 和彦, 杉浦, 和弘, 鶴田, 敬二, 戸田
Published in IEEJ JOURNAL OF INDUSTRY APPLICATIONS (2019)
Published in IEEJ JOURNAL OF INDUSTRY APPLICATIONS (2019)
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