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Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting
周灵平 汪明朴 王瑞 李周 朱家俊 彭坤 李德意 李绍禄
Published in Transactions of Nonferrous Metals Society of China (01.04.2008)
Published in Transactions of Nonferrous Metals Society of China (01.04.2008)
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Journal Article