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"中里, 典生"
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"中里, 典生"
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イメージセンサチップ実装時の反り低減技術
by
菊地, 広
,
中里
,
典生
,
田中, 直敬
,
野瀬, 藤明
,
望月, 千裕
Published in
映像情報メディア学会誌
(2009)
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固体接触面における接触熱コンダクタンスの金属薄膜による改善
by
大曽根, 靖夫
,
久保, 貴
,
中里
,
典生
Published in
日本機械学会論文集 B編
(2005)
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移動体通信用パワー半導体モジュールの放熱設計: モジュール熱抵抗の解析的予測
by
大曽根, 靖夫
,
中里
,
典生
,
梅本, 康成
,
根岸, 幹夫
Published in
日本機械学会論文集 B編
(2005)
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移動体通信用パワー半導体モジュールの放熱設計: 発熱領域間距離の最適化
by
大曽根, 靖夫
,
中里
,
典生
,
梅本, 康成
,
根岸, 幹夫
Published in
日本機械学会論文集 B編
(2005)
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電子機器きょう体内フィン付鉛直基板の自然対流冷却
by
中里
,
典生
,
平沢, 茂樹
,
森, 利行
,
大黒, 崇弘
Published in
日本機械学会論文集 B編
(1995)
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LSIチップ内のSOI構造トランジスタ素子の熱解析
by
平澤, 茂樹
,
中里
,
典生
,
吉原, 和弘
,
永井, 謙治
,
山口, 日出
,
大和田, 伸郎
Published in
日本機械学会論文集 B編
(01.01.1996)
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Improvement of Thermal Contact Conductance at Interface between Two Solid Samples by Using Thin Metal Films on the Sample Surface
by
OSONE, Yasuo
,
KUBO, Takashi
,
NAKAZATO, Norio
Published in
Nihon Kikai Gakkai rombunshuu. B hen
(2005)
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Thermal Design of Power Semiconductor Modules for Mobile Communication System: Numerical Estimation of Module Thermal Resistance
by
OSONE, Yasuo
,
NAKAZATO, Norio
,
UMEMOTO, Yasunari
,
NEGISHI, Mikio
Published in
Nihon Kikai Gakkai rombunshuu. B hen
(2005)
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Thermal Design of Power Semiconductor Modules for Mobile Communication System: Optimization of Distance between Heat-dissipating Cells
by
OSONE, Yasuo
,
NAKAZATO, Norio
,
UMEMOTO, Yasunari
,
NEGISHI, Mikio
Published in
Nihon Kikai Gakkai rombunshuu. B hen
(2005)
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Natural Convection Cooling of Vertical Finned Plates in an Electronic Cabinet
by
Nakazato, Norio
,
Hirasawa, Shigeki
,
Mori, Toshiyuki
,
Daikoku, Takahiro
Published in
Nihon Kikai Gakkai rombunshuu. B hen
(1995)
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Thermal Analysis of SOI Transistor Devices in LSI Chips
by
HIRASAWA, Shigeki
,
NAKAZATO, Norio
,
YOSHIHARA, Kazuhiro
,
NAGAI, Kenji
,
YAMAGUCHI, Hizuru
,
OWADA, Nobuo
Published in
Nihon Kikai Gakkai rombunshuu. B hen
(1996)
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