Au-Sn Eutectic Bonding Technology for LSI Package
Miura, Kazuma, Serizawa, Koji, Nakamura, Shozo
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1997)
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1997)
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Journal Article
Highly Reliable Inner Lead Bonding for Tape Carrier Package
SERIZAWA, Koji, MIURA, Kazuma, ISHIDA, Toshiharu, NAKAMURA, Shozo
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (05.11.1997)
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (05.11.1997)
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Journal Article
(3)肝における副血行路: b. 機能的・臨床的研究
Published in Nihon Naika Gakkai zasshi
(1962)
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