Mechanism of keyhole formation and stability in stationary laser welding
Lee, Jae Y, Ko, Sung H, Farson, Dave F, Yoo, Choong D
Published in Journal of physics. D, Applied physics (07.07.2002)
Published in Journal of physics. D, Applied physics (07.07.2002)
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Journal Article
Design of highly uniform spool and bar horns for ultrasonic bonding
Sun-Rak Kim, Jae Hak Lee, Yoo, C. D., Jun-Yeob Song, Lee, S. S.
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
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Journal Article
Modification of pinch instability theory for analysis of spray mode in GMAW
Park, Ah-Young, Kim, Sun-Rak, Hammad, Muhammad A, Yoo, Choong D
Published in Journal of physics. D, Applied physics (21.11.2009)
Published in Journal of physics. D, Applied physics (21.11.2009)
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Journal Article
Prediction of Solder Joint Profile in J-Lead Connection
Choi, Tong P., Yoo, Choong D., Lee, Tae S.
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1999)
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1999)
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Journal Article
Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching
Kim, Kwang-Seok, Lee, Young-Chul, Ahn, Jee-Hyuk, Song, Jun Yeob, Yoo, Choong D., Jung, Seung-Boo
Published in Korean Journal of Metals and Materials (25.11.2010)
Published in Korean Journal of Metals and Materials (25.11.2010)
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Journal Article
Influence of pad shape on self-alignment in electronic packaging
AHN, Do H, LEE, Jihye, YOO, Choong D, KIM, Yong-Seog
Published in Journal of electronic materials (01.03.2006)
Published in Journal of electronic materials (01.03.2006)
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Journal Article
Dynamic force balance model for metal transfer analysis in arc welding
Choi, Jae H, Lee, Jihye, Yoo, Choong D
Published in Journal of physics. D, Applied physics (07.09.2001)
Published in Journal of physics. D, Applied physics (07.09.2001)
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Journal Article
Modeling of Weld Pool Oscillation using Energy Method
YOO, Choong D., RICHARDSON, Richard W.
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1994)
Published in QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY (1994)
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Journal Article
Soldering method using longitudinal ultrasonic
Kim, J.H., Jihye Lee, Yoo, C.D.
Published in IEEE transactions on components and packaging technologies (01.09.2005)
Published in IEEE transactions on components and packaging technologies (01.09.2005)
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Journal Article
A study on the edge traces technique for 3D stack chip
Jae Hak Lee, Yoo, C. D., Jun-Yeob Song, Lee, S. S., Sun-Rak Kim
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding
Development of inclined conductive bump (ICB) for flip-chip interconnection
Ah-Young Park, Sun-Rak Kim, Yoo, C. D., Taek-Soo Kim
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
An efficient edge traces technique for 3D interconnection of stack chip
Sun-Rak Kim, Ah-Young Park, Yoo, C. D., Jae Hak Lee, Jun-Yeob Song, Lee, S. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding