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Year of Publication 17.03.2009
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IC chip uniform delayering methods
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Year of Publication 17.03.2009
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Year of Publication 17.03.2009
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IC CHIP UNIFORM DELAYERING METHODS
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Year of Publication 25.09.2008
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Ti liner for copper interconnect with low-k dielectric
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Interconnection structure and method for forming the same
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Ti liner for copper interconnect with low-k dielectric
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Year of Publication 09.12.2003
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Ti liner for copper interconnect with low-k dielectric
LU HSIAO-LING, SIMON ANDREW HERBERT, KLEPEIS STANLEY J, MARINO JEFFREY R, WANG YUN-YU, WONG KWONG HON, CLEVENGER LARRY, YANG CHIHAO
Year of Publication 09.12.2003
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Year of Publication 09.12.2003
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Ti liner for copper interconnect with low-k dielectric
CLEVENGER, LARRY, YUN-YU WANG, KLEPEIS, STANLEY J, MARINO, JEFFREY R, LU, HSIAO-LING, KWONG HON WONG, YANG, CHIN CHAO, SIMON, ANDREW H
Year of Publication 01.09.2004
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Year of Publication 01.09.2004
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