The Hybrid Stack-up with PTFE 5G Mm-Wave Antenna in Package (AiP)
Lu, Ying-Wei, Fang, Bo-Siang, Chen, Kuan-Ta, Lai, Chia-Chu, Jiang, Don-Son
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Assembly and Reliability Challenges for Next Generation High Thermal TIM Materials
Chi-An Pan, Chi-Tung Yeh, Wei-Chun Qiu, Rong-Zheng Lin, Liang-Yih Hung, Kong-Toon Ng, Lin, C. F., Chung, C. Key, Don-Son Jiang, Hsiao, C. S.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package
Teng, Wen-Yu, Hung, Liang-Yih, Lee, Jackson, Li, Debby, Chen, Carl, Jiang, Don-Son, Wang, Yu-Po
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
3DIC Stacking Process Investigation by Soldering Bonding Technology
Li, Jay, Jhen Chen, Wei, Lin, Joe, Hsuan Chan, Mu, Lo, Tank, Xu, Bruce, Yih Hung, Liang, Kao, Nicholas, Son Jiang, Don, Wang, Yu-Po
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Trend Plots for Different Mold-Thick Selection on Warpage Design of MUF FCCSP with 4L ETS
Chih-Sung Chen, Don Son Jiang, Kao, Nicholas
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Evaluation of new substrate surface finish: Electroless nickel/electroless palladium/immersion gold (ENEPIG)
Chun-Hsien Fu, Liang-Yi Hung, Don-Son Jiang, Chiang-Cheng Chang, Wang, Y.P., Hsiao, C.S.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Effect of minor doping elements on lead free solder joint quality
Don-Son Jiang, Yu-Po Wang, Hsiao, C.S.
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Larger FCBGA package with thin and normal core evaluation and characterization
Vito Lin, Kao, Nicholas, Don Son Jiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Different conservation laws utilized for warpage prediction of MUF FCCSP with 4L ETS
Chih-Sung Chen, Kao, Nicholas, Don Son Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETS
Chih-Sung Chen, Kao, Nicholas, Don Son Jiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Package with high thermal conductivity of graphite attached onto die surface to solve hot spot issue
Freedman Yen, Leo Hung, Kao, Nicholas, Don Son Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
High drop performance interconnection: Polymer cored solder ball
Yeng-Ping Wang, Liang Yi Hung, Don-Son Jiang, Chiang Cheng Chang, Yu-Po Wang, Hsiao, C.S.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Advantage and challenge of coreless flip-chip BGA
Lin, E., Chang, D., Don-Son Jiang, Wang, Y.P., Hsiao, C.S.
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
Published in 2007 International Microsystems, Packaging, Assembly and Circuits Technology (01.10.2007)
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Conference Proceeding
Molded wafer level package evaluation and characterization
Vito Lin, Kao, Nicholas, Don Son Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
A Methodology to Correct in-Fixture Measurement of Impedance by a Machine Learning Model
Fang, Bo-Siang, Lai, Chia-Chu, Lu, Ying-Wei, Chen, Kuan-Ta, Tasi, Mike, Jiang, Don-Son
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Package with simulation method to predict underfill flow pattern with different dispensed condition
Freedman Yen, Leo Hung, Hsin Long Chen, Hung, Joseph, Kao, Nicholas, Don Son Jiang
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Silver alloy wire bonding
Liao Jun Kai, Liang Yi Hung, Li Wei Wu, Men Yeh Chiang, Don Son Jiang, Huang, C. M., Yu Po Wang
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Enhanced package on package with coreless substrate optimal design evaluation
Lin, Vito, Liu, Kenet, Kao, Nicholas, Don Son Jiang
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding