Extension of CD-TEM Towards 3D Elemental Mapping
Baumann, Frieder H., Popielarski, Brian, Lu, Yinggang, Mitchell, Travis
Published in IEEE transactions on semiconductor manufacturing (01.08.2020)
Published in IEEE transactions on semiconductor manufacturing (01.08.2020)
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Journal Article
Towards Routine EDX Tomography in Semiconductor Failure Analysis
Baumann, Frieder H., Popielarski, Brian, Mitchell, Travis, Lu, Yinggang
Published in Microscopy and microanalysis (01.08.2019)
Published in Microscopy and microanalysis (01.08.2019)
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Journal Article
Characterization of VLSI Processing Defects Using STEM-EELS Tomography
Baumann, Frieder H., Miller, John, Rhoads, Bryan, Friedman, Anne, Fu, Bianzhu
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
Practical Considerations in Quantitative Nanoscale Energy-Dispersive X-ray Spectroscopy (EDX) and Its Application in SiGe
Weng, Weihao, Baumann, Frieder H., Ke, Yue, Loesing, Rainer, Madan, Anita, Zhu, Zhengmao, Katnani, Ahmad D.
Published in Microscopy and microanalysis (01.08.2015)
Published in Microscopy and microanalysis (01.08.2015)
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Journal Article
Extension of CD-TEM towards EDS Tomography
Baumann, Frieder H., Popielarski, Brian, Lu, Yinggang
Published in 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2019)
Published in 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2019)
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Conference Proceeding
How to Avoid Artifacts in Nanobeam Diffraction Strain Measurements
Fu, B., Gribelyuk, M., Baumann, Frieder H., Wang, Yun-yu
Published in Microscopy and microanalysis (01.07.2017)
Published in Microscopy and microanalysis (01.07.2017)
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Journal Article
Spring-lattice model for fast, flexible and easy strain prediction in semiconductor devices ET/ID: Enabling technologies and innovative devices
Baumann, Frieder H., Guinel, Maxime J-F
Published in 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2017)
Published in 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2017)
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Conference Proceeding
Advances in Elemental Electron Tomography for the State-of-the-art Semiconductor Devices and Circuits Characterization and Failure Analysis
Fu, B., Gribelyuk, M, Baumann, Frieder H., Fang, C., Zhao, Wayne, Chen, E., Brooks, I.
Published in Microscopy and microanalysis (01.07.2017)
Published in Microscopy and microanalysis (01.07.2017)
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Journal Article
Failure Analysis of Photonic Integrated Circuits
Baumann, Frieder H., Popielarski, Brian, Sweeney, Ryan, Beaudoin, Felix, Giewont, Ken
Published in Electronic device failure analysis (01.08.2023)
Published in Electronic device failure analysis (01.08.2023)
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Magazine Article
Moisture Uptake Impact on Damage Layer of Porous Low-k Film in 80nm-Pitched Cu Interconnects
Tagami, Masayoshi, Ogino, Atsushi, Miyajima, Hideshi, Shobha, Hosadurga, Baumann, Frieder H., Ito, Fuminori, Spooner, Terry
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
Published in Meeting abstracts (Electrochemical Society) (01.08.2011)
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Journal Article
Copper interconnect with CVD liner and metallic cap
BOLOM TIBOR, HU CHAO-KUN, NIU CHENGYU, SIMON ANDREW H, BAUMANN FRIEDER H, MOTOYAMA KOICHI
Year of Publication 18.08.2015
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Year of Publication 18.08.2015
Patent
COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
BOLOM TIBOR, HU CHAO-KUN, NIU CHENGYU, SIMON ANDREW H, BAUMANN FRIEDER H, MOTOYAMA KOICHI
Year of Publication 05.03.2015
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Year of Publication 05.03.2015
Patent
Wafer Scale Cu Plating Process Optimization for Defectivity Improvement
Ahmed, Shafaat, Huang, Qiang, Cheng, Tien, Findeis, Paul, Gruszecki, Craig R, Simon, Andrew H, Mclaughlin, Paul S, Lustig, Naftali, Engbrecht, Edward, Lakritz, Mark N, Wang, Pei I, Montgomery, Christa L, Mittal, Surbhi, Baumann, Frieder H, Truong, Connie-Nga, Baker-O'neal, Brett C., Grunow, Sarah L, Chudzik, Michael P, Grunow, Stephan
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
Published in Meeting abstracts (Electrochemical Society) (01.04.2014)
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Journal Article