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Superconducting Bump Bonds for Quantum Computing Systems

Superconducting Bump Bonds for Quantum Computing Systems

by Buckley, Bob Benjamin, Yao, Zhimin Jamie
Year of Publication 29.06.2023

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Patent

Superconducting bump bonds for quantum computing systems

Superconducting bump bonds for quantum computing systems

by Buckley, Bob Benjamin, Yao, Zhimin Jamie
Year of Publication 07.03.2023

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by HAMILTON, Michael C, GIUSTINA, Marissa, WHITE, Theodore Charles, YAO, Zhimin Jamie, BURKETT, Brian James, NAAMAN, Ofer
Year of Publication 18.07.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by HAMILTON, Michael C, GIUSTINA, Marissa, WHITE, Theodore Charles, YAO, Zhimin Jamie, BURKETT, Brian James, NAAMAN, Ofer
Year of Publication 20.06.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by Yao, Zhimin Jamie, White, Theodore Charles, Naaman, Ofer, Hamilton, Michael C, Burkett, Brian James, Giustina, Marissa
Year of Publication 13.06.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by Yao, Zhimin Jamie, White, Theodore Charles, Naaman, Ofer, Hamilton, Michael C, Burkett, Brian James, Giustina, Marissa
Year of Publication 13.06.2024

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Patent

High power LEDs with non-polymer material lenses and methods of making the same

High power LEDs with non-polymer material lenses and methods of making the same

by YAO ZHIMIN JAMIE
Year of Publication 12.07.2016

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Patent

HIGH POWER LEDS

HIGH POWER LEDS

by YAO ZHIMIN JAMIE
Year of Publication 21.05.2015

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Patent

Electronic device submounts including substrates with thermally conductive vias

Electronic device submounts including substrates with thermally conductive vias

by YAO ZHIMIN JAMIE
Year of Publication 08.07.2014

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Patent

High voltage wire bond free LEDS

High voltage wire bond free LEDS

by YAO ZHIMIN JAMIE
Year of Publication 17.09.2013

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Patent

High efficiency LEDs

High efficiency LEDs

by YAO ZHIMIN JAMIE
Year of Publication 04.06.2013

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Patent

HIGH EFFICIENCY LEDS

HIGH EFFICIENCY LEDS

by YAO ZHIMIN JAMIE
Year of Publication 11.10.2012

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Patent

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

by YAO ZHIMIN JAMIE
Year of Publication 28.06.2012

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Patent

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

by YAO, ZHIMIN JAMIE
Year of Publication 28.06.2012

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Patent

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

by YAO, ZHIMIN, JAMIE
Year of Publication 21.06.2012

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Patent

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

by YAO ZHIMIN JAMIE
Year of Publication 21.06.2012

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Patent

HIGH VOLTAGE WIRE BOND FREE LEDS

HIGH VOLTAGE WIRE BOND FREE LEDS

by YAO, ZHIMIN, JAMIE
Year of Publication 19.04.2012

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Patent

HIGH VOLTAGE WIRE BOND FREE LEDS

HIGH VOLTAGE WIRE BOND FREE LEDS

by YAO ZHIMIN JAMIE
Year of Publication 14.04.2011

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Patent

White-emitting LED chips and method for making same

White-emitting LED chips and method for making same

by YAO ZHIMIN JAMIE, IBBETSON JAMES
Year of Publication 11.12.2012

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Patent

White-emitting LED chips and method for making same

White-emitting LED chips and method for making same

by Yao, Zhimin Jamie, Ibbetson, James
Year of Publication 11.12.2012

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Patent