Electrochemical protection of thin film electrodes in solid state nanopores
Harrer, Stefan, Waggoner, Philip S, Luan, Binquan, Afzali-Ardakani, Ali, Goldfarb, Dario L, Peng, Hongbo, Martyna, Glenn, Rossnagel, Stephen M, Stolovitzky, Gustavo A
Published in Nanotechnology (08.07.2011)
Published in Nanotechnology (08.07.2011)
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Journal Article
Characterizing and Controlling the Motion of ssDNA in a Solid-State Nanopore
Luan, Binquan, Stolovitzky, Gustavo, Peng, Hongbo, Harrer, Stefan, Waggoner, Philip, Polonsky, Stas, Rossnagel, Stephen, Martyna, Glenn
Published in Biophysical journal (01.02.2011)
Published in Biophysical journal (01.02.2011)
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Journal Article
Functionalizing a Nanopore with Nano-Electrodes Towards the Control of the Translocation of DNA with Single Base Resolution
Peng, Hongbo, Luan, Binquan, Waggoner, Philip S., Harrer, Stefan, Martyna, Glenn J., Polonsky, Stanislav, Rossnagel, Stephen M., Stolovitzky, Gustavo
Published in Biophysical journal (01.02.2011)
Published in Biophysical journal (01.02.2011)
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Journal Article
Techniques to improve reliability in Cu interconnects using Cu intermetallics
Rossnagel, Stephen M, Shaw, Thomas M, Hu, Chao-Kun, Lavoie, Christian
Year of Publication 09.03.2021
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Year of Publication 09.03.2021
Patent
Techniques to improve reliability in cu interconnects using cu intermetallics
Chao-Kun HU, Christian Lavoie, Stephen Rossnagel, Thomas McCarroll Shaw
Year of Publication 24.02.2021
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Year of Publication 24.02.2021
Patent
Techniques to improve reliability in Cu interconnects using Cu intermetallics
Rossnagel, Stephen M, Shaw, Thomas M, Hu, Chao-Kun, Lavoie, Christian
Year of Publication 27.10.2020
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Year of Publication 27.10.2020
Patent
Self-aligned 3D solid state thin film battery
Rossnagel, Stephen M, Libsch, Frank Robert, Lee, Ko-Tao, Shahidi, Ghavam G
Year of Publication 21.07.2020
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Year of Publication 21.07.2020
Patent
Self-aligned, over etched hard mask fabrication method and structure
Rossnagel, Stephen M, Libsch, Frank Robert, Lee, Ko-Tao, Shahidi, Ghavam G
Year of Publication 09.06.2020
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Year of Publication 09.06.2020
Patent
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics
Rossnagel, Stephen M, Shaw, Thomas M, Hu, Chao-Kun, Lavoie, Christian
Year of Publication 02.01.2020
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Year of Publication 02.01.2020
Patent
Techniques to Improve Reliability in Cu Interconnects Using Cu Intermetallics
Rossnagel, Stephen M, Shaw, Thomas M, Hu, Chao-Kun, Lavoie, Christian
Year of Publication 02.01.2020
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Year of Publication 02.01.2020
Patent
Techniques to improve reliability in Cu interconnects using Cu intermetallics
Rossnagel, Stephen M, Shaw, Thomas M, Hu, Chao-Kun, Lavoie, Christian
Year of Publication 29.10.2019
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Year of Publication 29.10.2019
Patent