Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics
Joung-phil Lee, Su-jung Hyung, Yeong-seok Kim, Kyung-suk Oh, Ji-han Ko, Hwa-il Jin, Won-keun Kim, Kil-soo Kim
Year of Publication 29.04.2020
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Year of Publication 29.04.2020
Patent
SEMICONDUCTOR PACKAGES HAVING IMPROVED THERMAL DISCHARGE AND ELECTROMAGNETIC SHIELDING CHARACTERISTICS
KIM KIL-SOO, KIM YEONG-SEOK, KIM WON-KEUN, JIN HWA-IL, OH KYUNG-SUK, KO JI-HAN, HYUNG SU-JUNG, LEE JOUNG-PHIL
Year of Publication 10.03.2020
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Year of Publication 10.03.2020
Patent