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Year of Publication 11.07.2024
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Year of Publication 11.07.2024
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Integrated circuit direct cooling systems having substrates in contact with a cooling medium
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 23.04.2024
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Year of Publication 23.04.2024
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Semiconductor package and related methods
Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 15.06.2021
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Year of Publication 15.06.2021
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INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 24.03.2022
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Year of Publication 24.03.2022
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Semiconductor package having a spacer with a junction cooling pipe
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 14.12.2021
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Year of Publication 14.12.2021
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SEMICONDUCTOR PACKAGE AND RELATED METHODS
ZSCHIESCHANG, Olaf, JONG, Mankyo, SON, JoonSeo, IM, Seungwon, JEON, Oseob
Year of Publication 26.08.2021
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Year of Publication 26.08.2021
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Semiconductor package and related methods
Im, Seungwon, Jong, Mankyo, Jeon, Oseob, Zschieschang, Olaf, Son, JoonSeo
Year of Publication 03.09.2019
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Year of Publication 03.09.2019
Patent
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
PARK, Changyoung, LEE, Yoonsoo, LEE, Byoungok, IM, Seungwon, JEON, Oseob, LEE, Dukyong, SON, Joonseo
Year of Publication 11.06.2020
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Year of Publication 11.06.2020
Patent
Semiconductor package having junction cooling pipes embedded in substrates
Lee, Byoungok, Im, Seungwon, Lee, Yoonsoo, Son, Joonseo, Jeon, Oseob, Park, Changyoung, Lee, Dukyong
Year of Publication 31.03.2020
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Year of Publication 31.03.2020
Patent