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"GOH KIM-YONG"
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Search Results - "GOH KIM-YONG"
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"GOH KIM-YONG"
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Semiconductor packages having an electric device with a recess
by
Zhang, Xueren
,
Goh
,
Kim
-
Yong
,
Ma, Yiyi
Year of Publication
19.05.2020
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SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
08.02.2018
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Semiconductor packages having an electric device with a recess
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
21.11.2017
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Ball grid array to pin grid array conversion
by
GOH KIM
-
YONG
Year of Publication
28.01.2014
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Multi-stacked semiconductor dice scale package structure and method of manufacturing same
by
GOH KIM
-
YONG
Year of Publication
06.08.2013
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BALL GRID ARRAY TO PIN GRID ARRAY CONVERSION
by
GOH KIM
-
YONG
Year of Publication
23.05.2013
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Fan-out wafer level package with polymeric layer for high reliability
by
GOH KIM
-
YONG
Year of Publication
07.05.2013
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Semiconductor package and method of manufacturing the same
by
GOH KIM
-
YONG
Year of Publication
02.04.2013
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Wafer level chip scale package (WLCSP) having edge protection
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
21.02.2017
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Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
by
Duca Roseanne
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
20.09.2016
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LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING THE SAME
by
GOH KIM
-
YONG
Year of Publication
05.07.2012
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Offset of contact opening for copper pillars in flip chip packages
by
GOH KIM
-
YONG
,
ZHANG XUEREN
Year of Publication
08.07.2014
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ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVITY AND RELATED METHODS
by
WONG WING SHENQ
,
GOH KIM
-
YONG
Year of Publication
19.11.2015
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FAN-OUT WAFER LEVEL PACKAGE WITH POLYMERIC LAYER FOR HIGH RELIABILITY
by
GOH KIM
-
YONG
Year of Publication
30.06.2011
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MULTI-STACKED SEMICONDUCTOR DICE SCALE PACKAGE STRUCTURE AND METHOD OF MANUFACTURING SAME
by
GOH KIM
-
YONG
Year of Publication
30.06.2011
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OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
by
GOH KIM
-
YONG
,
ZHANG XUEREN
Year of Publication
13.06.2013
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Integrated circuit device with shaped leads and method of forming the device
by
Goh Wei Zhen
,
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
13.06.2017
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Electronic device with heat dissipater
by
Duca Roseanne
,
Goh Kim
-
Yong
,
Motta Valter
,
Zhang Xueren
Year of Publication
11.04.2017
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ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
by
GOH Kim
-
Yong
,
ZHANG Xueren
,
MA Yiyi
Year of Publication
06.10.2016
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Window clamp top plate for integrated circuit packaging
by
GOH KIM
-
YONG
,
WONG WINGSHENQ
,
ZHANG XUEREN
Year of Publication
05.08.2014
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