Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
Jun, So-Yeon, Bang, Jung-Hwan, Kim, Min-Su, Han, Deok-Gon, Lee, Tae-Young, Yoo, Sehoon
Published in Materials (20.02.2023)
Published in Materials (20.02.2023)
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The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Park, Yujin, Bang, Jung-Hwan, Oh, Chul, Hong, Won, Kang, Namhyun
Published in Metals (Basel ) (01.12.2017)
Published in Metals (Basel ) (01.12.2017)
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Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
Seo, Wonil, Kim, Kyoung-Ho, Bang, Jung-Hwan, Kim, Mok-Soon, Yoo, Sehoon
Published in Journal of electronic materials (01.12.2014)
Published in Journal of electronic materials (01.12.2014)
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