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"TANGPUZ CONSUELO N"
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Search Results - "TANGPUZ CONSUELO N"
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"TANGPUZ CONSUELO N"
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INTEGRATED TRANSISTOR MODULE AND METHOD OF FABRICATING SAME
by
JOSHI, RAJEEV, D
,
TANGPUZ
,
CONSUELO
,
N
,
NOQUIL, JONATHAN, A
Year of Publication
30.06.2014
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LEADLESS SEMICONDUCTOR DEVICE TERMINAL
by
GOMEZ JOCEL P
,
TANGPUZ CONSUELO N
Year of Publication
28.04.2011
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Integrated transistor module and method of fabricating same
by
Joshi, Rajeev D
,
Noquil, Jonathan A
,
Tangpuz
,
Consuelo N
Year of Publication
30.11.2010
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Integrated transistor module and method of fabricating same
by
JOSHI RAJEEV D
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
30.11.2010
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Semiconductor device including molded wireless exposed drain packaging
by
TANGPUZ
,
CONSUELO N
,
QUINONES, MARIA C. Y
Year of Publication
21.09.2007
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Substrate based unmolded package
by
Joshi, Rajeev
,
Noquil, Jonathan A
,
Tangpuz
,
Consuelo N
Year of Publication
23.03.2010
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Substrate based unmolded package
by
JOSHI RAJEEV
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
23.03.2010
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Flip chip in leaded molded package and method of manufacture thereof
by
MANATAD ROMEL N
,
JOSHI RAJEEV
,
TANGPUZ CONSUELO N
Year of Publication
01.09.2009
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Flip chip in leaded molded package and method of manufacture thereof
by
Joshi, Rajeev
,
Tangpuz
,
Consuelo N
,
Manatad, Romel N
Year of Publication
01.09.2009
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INTEGRATED TRANSISTOR MODULE AND METHOD OF FABRICATING SAME
by
JOSHI RAJEEV D
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
07.05.2009
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Integrated transistor module and method of fabricating same
by
Joshi, Rajeev D
,
Noquil, Jonathan A
,
Tangpuz
,
Consuelo N
Year of Publication
10.03.2009
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Integrated transistor module and method of fabricating same
by
JOSHI RAJEEV D
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
10.03.2009
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Semiconductor device including molded wireless exposed drain packaging
by
Quinones, Maria C. Y
,
Tangpuz
,
Consuelo N
Year of Publication
24.01.2006
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Semiconductor device including molded wireless exposed drain packaging
by
QUINONES MARIA C. Y
,
TANGPUZ CONSUELO N
Year of Publication
24.01.2006
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Substrate based unmolded package
by
Joshi, Rajeev
,
Noquil, Jonathan A
,
Tangpuz
,
Consuelo N
Year of Publication
21.10.2008
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Substrate based unmolded package
by
JOSHI RAJEEV
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
21.10.2008
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SUBSTRATE BASED UNMOLDED PACKAGE
by
JOSHI RAJEEV
,
NOQUIL JONATHAN A
,
TANGPUZ CONSUELO N
Year of Publication
04.09.2008
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FLIP CHIP IN LEADED MOLDED PACKAGE AND METHOD OF MANUFACTURE THEREOF
by
MANATAD ROMEL N
,
JOSHI RAJEEV
,
TANGPUZ CONSUELO N
Year of Publication
14.02.2008
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Integrated transistor module and method of fabricating same
by
JOSHI RAJEEV D.,NOQUIL JONATHAN A.,
TANGPUZ CONSUELO N
Year of Publication
08.08.2007
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Integriertes Transistormodul und Verfahren zu dessen Herstellung
by
JOSHI, RAJEEV D
,
TANGPUZ
,
CONSUELO N
,
NOQUIL, JONATHAN A
Year of Publication
16.05.2007
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