Electromigration-aware routing for 3D ICs with stress-aware EM modeling
Pak, Jiwoo, Lim, Sung Kyu, Pan, David Z.
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
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Conference Proceeding
A graph placement methodology for fast chip design
Mirhoseini, Azalia, Goldie, Anna, Yazgan, Mustafa, Jiang, Joe Wenjie, Songhori, Ebrahim, Wang, Shen, Lee, Young-Joon, Johnson, Eric, Pathak, Omkar, Nova, Azade, Pak, Jiwoo, Tong, Andy, Srinivasa, Kavya, Hang, William, Tuncer, Emre, Le, Quoc V., Laudon, James, Ho, Richard, Carpenter, Roger, Dean, Jeff
Published in Nature (London) (10.06.2021)
Published in Nature (London) (10.06.2021)
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Journal Article
Modeling of electromigration in through-silicon-via based 3D IC
Jiwoo Pak, Pathak, M., Sung Kyu Lim, Pan, D. Z.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Journal Article
Electromigration-aware redundant via insertion
Jiwoo Pak, Yu Bei, Pan, David Z.
Published in The 20th Asia and South Pacific Design Automation Conference (01.01.2015)
Published in The 20th Asia and South Pacific Design Automation Conference (01.01.2015)
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Conference Proceeding
Journal Article
Addendum: A graph placement methodology for fast chip design
Goldie, Anna, Mirhoseini, Azalia, Yazgan, Mustafa, Jiang, Joe Wenjie, Songhori, Ebrahim, Wang, Shen, Lee, Young-Joon, Johnson, Eric, Pathak, Omkar, Nova, Azade, Pak, Jiwoo, Tong, Andy, Srinivasa, Kavya, Hang, William, Tuncer, Emre, Le, Quoc V., Laudon, James, Ho, Richard, Carpenter, Roger, Dean, Jeff
Published in Nature (London) (26.09.2024)
Published in Nature (London) (26.09.2024)
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Journal Article
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs
Jiwoo Pak, Sung Kyu Lim, Pan, David Z.
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
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Conference Proceeding
Author Correction: A graph placement methodology for fast chip design
Mirhoseini, Azalia, Goldie, Anna, Yazgan, Mustafa, Jiang, Joe Wenjie, Songhori, Ebrahim, Wang, Shen, Lee, Young-Joon, Johnson, Eric, Pathak, Omkar, Nova, Azade, Pak, Jiwoo, Tong, Andy, Srinivasa, Kavya, Hang, William, Tuncer, Emre, Le, Quoc V., Laudon, James, Ho, Richard, Carpenter, Roger, Dean, Jeff
Published in Nature (21.04.2022)
Published in Nature (21.04.2022)
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Journal Article
Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs
Jae-Seok Yang, Jiwoo Pak, Xin Zhao, Sung Kyu Lim, Pan, D Z
Published in 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011) (01.01.2011)
Published in 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011) (01.01.2011)
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Conference Proceeding
Design for manufacturability and reliability for TSV-based 3D ICs
Pan, D. Z., Sung Kyu Lim, Athikulwongse, K., Moongon Jung, Mitra, J., Jiwoo Pak, Pathak, M., Jae-seok Yang
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
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Conference Proceeding
A frequency tunable resonant clock distribution scheme using bond-wire inductor
Woojin Lee, Pak, Jun So, Jiwoo Pak, Chunghyun Ryu, Jongbae Park, Kim, Joungho
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
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Conference Proceeding
Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation
Jiwoo Pak, Myunghyun Ha, Jaemin Kim, Donghee Kang, Ho Choi, Seyoung Kwon, Keunsoo La, Joungho Kim
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Electromigration-aware redundant via insertion
Pak, Jiwoo, Yu, Bei, Pan, David Z
Published in The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings (01.01.2015)
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Published in The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Conference Proceedings (01.01.2015)
Conference Proceeding
Chip Placement with Deep Reinforcement Learning
Mirhoseini, Azalia, Goldie, Anna, Yazgan, Mustafa, Jiang, Joe, Songhori, Ebrahim, Wang, Shen, Lee, Young-Joon, Johnson, Eric, Pathak, Omkar, Bae, Sungmin, Nazi, Azade, Pak, Jiwoo, Tong, Andy, Srinivasa, Kavya, Hang, William, Tuncer, Emre, Babu, Anand, Le, Quoc V, Laudon, James, Ho, Richard, Carpenter, Roger, Dean, Jeff
Published in arXiv (Cornell University) (22.04.2020)
Published in arXiv (Cornell University) (22.04.2020)
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Journal Article
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs
Pak, Jiwoo, Lim, Sung Kyu, Pan, David Z.
Published in Proceedings of the International Conference on Computer-Aided Design (18.11.2013)
Published in Proceedings of the International Conference on Computer-Aided Design (18.11.2013)
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Conference Proceeding
Chip Placement with Deep Reinforcement Learning
Mirhoseini, Azalia, Goldie, Anna, Yazgan, Mustafa, Jiang, Joe, Songhori, Ebrahim, Wang, Shen, Young-Joon, Lee, Johnson, Eric, Pathak, Omkar, Bae, Sungmin, Nazi, Azade, Pak, Jiwoo, Tong, Andy, Kavya Srinivasa, Hang, William, Tuncer, Emre, Babu, Anand, Le, Quoc V, Laudon, James, Ho, Richard, Carpenter, Roger, Dean, Jeff
Published in arXiv.org (22.04.2020)
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Published in arXiv.org (22.04.2020)
Paper
Robust clock tree synthesis with timing yield optimization for 3D-ICs
Yang, Jae-Seok, Pak, Jiwoo, Zhao, Xin, Lim, Sung Kyu, Pan, David Z.
Published in Proceedings of the 16th Asia and South Pacific Design Automation Conference (25.01.2011)
Published in Proceedings of the 16th Asia and South Pacific Design Automation Conference (25.01.2011)
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Conference Proceeding