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Published in AIP Conference Proceedings (19.06.2014)
Published in AIP Conference Proceedings (19.06.2014)
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Conference Proceeding
Post porosity plasma protection integration at 48 nm pitch
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Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Cu CMP and its Challenge for 20nm Nodes and Beyond
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Published in MRS proceedings (2012)
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Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
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Published in ECS transactions (01.08.2017)
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Published in ECS transactions (26.04.2017)
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Discovery of aromadendrane anologues from the marine-derived fungus Scedosporium dehoogii F41-4 by NMR-guided isolationElectronic supplementary information (ESI) available: The NMR spectra data of compounds 1-9. See DOI: 10.1039/c6ra21142a
Hu, Kun-Chao, Xu, Meng-Yang, Li, Hou-Jin, Yuan, Jie, Tang, Ge, Xu, Jun, Yang, De-Po, Lan, Wen-Jian
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Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects
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Published in ECS transactions (26.03.2014)
Published in ECS transactions (26.03.2014)
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