Analysis and Optimization of Low-Power Passive Equalizers for CPU-Memory Links
Ling Zhang, Wenjian Yu, Yulei Zhang, Renshen Wang, Deutsch, A., Katopis, G. A., Dreps, D. M., Buckwalter, J., Kuh, E. S., Chung-Kuan Cheng
Published in IEEE Transactions on Components, Packaging and Manufacturing Technology (01.09.2011)
Published in IEEE Transactions on Components, Packaging and Manufacturing Technology (01.09.2011)
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Journal Article
Analyses of Via-In-Pad Plated Over (VIPPO) and Dogbone in Fanout Routing High-Density Interconnects
Zhang, Yanyan, Tang, Junyan, Duan, Xiaomin, Datta, Srijan, Paladhi, Pavel R., Bohra, Mahesh, Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
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Conference Proceeding
Analysis of Differential Stripline Routing Approaches within a PCB Via Field for Crosstalk Mitigation
Datta, Srijan, Wang, Yuechen, Tang, Junyan, Yang, Xianbo, Zhang, Yanyan, Paladhi, Pavel R., Bohra, Mahesh, Myers, Joshua C., Chun, Sungjun, Dreps, Daniel M.
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
Published in 2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (15.10.2023)
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Conference Proceeding
Broadside-Coupled Differential Routing In Package Via Pin-Field Design
Zhang, Yanyan, Walls, Lloyd, Bohra, Mahesh, Tang, Junyan, Yang, Xianbo, Becker, Wiren D., Dreps, Daniel M.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields
Tang, Junyan, Yang, Xianbo, Hejase, Jose A., Bohra, Mahesh, Zhang, Yanyan, Duan, Xiaomin, Kaller, Dierk, Becker, Wiren D., Dreps, Daniel M.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Signal Integrity Characterization of Channels With Asymmetric Via Stubs
Zhang, Yanyan, Bohra, Mahesh, Pham, Nam, Paladhi, Pavel R., Becker, Wiren D., Dreps, Daniel M.
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
Published in 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2020)
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Conference Proceeding
Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Chun, Sungjun, Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding
An Approach For Tuning Signal Integrity Properties Of Edge Card Connectors With Conductive Fixture In High-Speed Link Channels
Zhang, Yanyan, Hejase, Jose A., Bohra, Mahesh, Paladhi, Pavel R., Shan, Lei, Chun, Sungjun, Audet, Jean J., Becker, Wiren D., Dreps, Daniel M.
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding
Vertical and Horizontal Transitions of Substrate Integrated Waveguides Within a Multi-Layered PCB for High Speed Signaling Applications
Myers, Joshua C., Hejase, Jose A., Tang, Junyan, Paladhi, Pavel R., Becker, Wiren D., Chun, Sungjun, Dreps, Daniel M.
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
Published in 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2018)
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Conference Proceeding
Journal Article
DC wander effect of DC blocking capacitors on PCIe Gen3 signal integrity
Na, Nanju, Dreps, Daniel M., Hejase, Jose A.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Journal Article
Contutto: a novel FPGA-based prototyping platform enabling innovation in the memory subsystem of a server class processor
Sukhwani, Bharat, Roewer, Thomas, Haymes, Charles L., Kim, Kyu-Hyoun, McPadden, Adam J., Dreps, Daniel M., Sanner, Dean, Van Lunteren, Jan, Asaad, Sameh
Published in 2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) (14.10.2017)
Published in 2017 50th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) (14.10.2017)
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Conference Proceeding
High-speed bus signal integrity compliance using a frequency-domain model
Win, Si T., Hejase, Jose, Becker, Wiren D., Wiedemeier, Glen, Dreps, Daniel M., Myers, Joshua C., Willis, Ken, Horner, John, Varma, Ambrish
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.07.2016)
Published in 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) (01.07.2016)
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Conference Proceeding
Low Power Passive Equalizer Design for Computer Memory Links
Ling Zhang, Wenjian Yu, Yulei Zhang, Renshen Wang, Deutsch, A., Katopis, G.A., Dreps, D.M., Buckwalter, J., Kuh, E., Chung-Kuan Cheng
Published in 2008 16th IEEE Symposium on High Performance Interconnects (01.01.2008)
Published in 2008 16th IEEE Symposium on High Performance Interconnects (01.01.2008)
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Conference Proceeding
Journal Article