Numerical and experimental studies of ultra low profile three-dimensional heat sinks (3DHS) made using a novel manufacturing approach
Kota, K., Sobers, D., Kolodner, P., Bajaj, N., Jen-Hau Cheng, Simon, E., Salamon, T.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding
A low band gap iron sulfide hybrid semiconductor with unique 2D [Fe(16)S(20)](8-) layer and reduced thermal conductivity
Wu, Min, Rhee, Jessica, Emge, Thomas J, Yao, Hongbin, Cheng, Jen-Hau, Thiagarajan, Suraj, Croft, Mark, Yang, Ronggui, Li, Jing
Published in Chemical communications (Cambridge, England) (14.03.2010)
Published in Chemical communications (Cambridge, England) (14.03.2010)
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Journal Article
A novel fabrication method of embedded micro-channels by using SU-8 thick-film photoresists
Chuang, Yun-Ju, Tseng, Fan-Gang, Cheng, Jen-Hau, Lin, Wei-Keng
Published in Sensors and actuators. A, Physical (15.01.2003)
Published in Sensors and actuators. A, Physical (15.01.2003)
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Journal Article
Conference Proceeding
Atomic layer deposition enabled interconnect technology for vertical nanowire arrays
Cheng, Jen-Hau, Seghete, Dragos, Lee, Myongjai, Schlager, John B., Bertness, Kris A., Sanford, Norman A., Yang, Ronggui, George, Steven M., Lee, Y.C.
Published in Sensors and actuators. A. Physical. (2011)
Published in Sensors and actuators. A. Physical. (2011)
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Journal Article
Cooling performance of silicon-based thermoelectric device on high power LED
Jen-Hau Cheng, Chun-Kai Liu, Yu-Lin Chao, Ra-Min Tain
Published in ICT 2005. 24th International Conference on Thermoelectrics, 2005 (2005)
Published in ICT 2005. 24th International Conference on Thermoelectrics, 2005 (2005)
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Conference Proceeding
Thermal management of vertical gallium nitride nanowire arrays: Cooling design and tip temperature measurement
Jen-Hau Cheng, Seghete, Dragos, George, Steven M, Ronggui Yang, Lee, Y C
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2010)
Published in 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2010)
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Conference Proceeding
Packaging and interconnect technologies for the development of GaN nanowire-based light emitting diodes
Myongjai Lee, Jen-Hau Cheng, Lee, Y.C., Seghete, D., George, S.M., Schlager, J.B., Bertness, K., Sanford, N.A.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Self-driven flow loop in microscale
Cheng, Jen-Hau, Tseng, Yuan-Tai, Tseng, Fan-Gang, Lin, Wei-Keng, Chieng, Ching-Chang
Published in Journal of the Chinese Society of Mechanical Engineers (01.04.2005)
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Published in Journal of the Chinese Society of Mechanical Engineers (01.04.2005)
Journal Article
ChemInform Abstract: A Low Band Gap Iron Sulfide Hybrid Semiconductor with Unique 2D [Fe16S20]8- Layer and Reduced Thermal Conductivity
Wu, Min, Rhee, Jessica, Emge, Thomas J., Yao, Hongbin, Cheng, Jen-Hau, Thiagarajan, Suraj, Croft, Mark, Yang, Ronggui, Li, Jing
Published in ChemInform (01.06.2010)
Published in ChemInform (01.06.2010)
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Journal Article
Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration
Chien, Chun-Hsien, Lee, Ching-Kuan, Yu, Hsun, Liu, Chang-Chih, Chen, Peng-Shu, Chien, Heng-Chieh, Cheng, Jen-Hau, Liao, Li-Ling, Dai, Ming-Ji, Lin, Yu-Min, Zhan, Chau-Jie, Ko, Cheng-Ta, Lo, Wei-Chung, Lu, Yung Jean (Rachel)
Published in International Symposium on Microelectronics (01.01.2013)
Published in International Symposium on Microelectronics (01.01.2013)
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Journal Article
Atomic layer deposition enabled interconnect technology for vertical nanowire array devices
Myongjai Lee, Jen-Hau Cheng, Bertness, K., Sanford, N., Seghete, D., George, S., Lee, Y.C.
Published in TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2009)
Published in TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2009)
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Conference Proceeding
A low band gap iron sulfide hybrid semiconductor with unique 2D [Fe16S20]8− layer and reduced thermal conductivity
Wu, Min, Rhee, Jessica, Emge, Thomas J., Yao, Hongbin, Cheng, Jen-Hau, Thiagarajan, Suraj, Croft, Mark, Yang, Ronggui, Li, Jing
Published in Chemical communications (Cambridge, England) (2010)
Published in Chemical communications (Cambridge, England) (2010)
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Journal Article
Thermal ground plane
Oshman, Christopher, Bright, Victor M, Li, Chen, Peterson, George P, Cheng, Jen-Hau, Lee, Yung-Cheng, Shi, Bo, Yang, Ronggui
Year of Publication 07.06.2022
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Year of Publication 07.06.2022
Patent
THERMAL GROUND PLANE
Oshman, Christopher, Bright, Victor M, Li, Chen, Peterson, George P, Cheng, Jen-Hau, Lee, Yung-Cheng, Shi, Bo, Yang, Ronggui
Year of Publication 18.06.2020
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Year of Publication 18.06.2020
Patent
Thermal ground plane
Oshman, Christopher, Bright, Victor M, Li, Chen, Peterson, George P, Cheng, Jen-Hau, Lee, Yung-Cheng, Shi, Bo, Yang, Ronggui
Year of Publication 25.02.2020
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Year of Publication 25.02.2020
Patent
Thermal ground plane
Oshman, Christopher, Bright, Victor M, Li, Chen, Peterson, George P, Cheng, Jen-Hau, Lee, Yung-Cheng, Shi, Bo, Yang, Ronggui
Year of Publication 07.01.2020
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Year of Publication 07.01.2020
Patent