Mechanical behaviour and fatigue of copper ribbons used as solar cell interconnectors
Wiese, Steffen, Meier, Rico, Kraemer, Frank
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders
Syed, Ahmer
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
High temperature storage influence on molding compound properties
de Vreugd, J, Jansen, K M B, Ernst, L J, Bohm, C, Pufall, R
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Copper pillar bump structure optimization for flip chip packaging with Cu/Low-K stack
Zhang, X R, Zhu, W H, Liew, B P, Gaurav, M, Yeo, A, Chan, K C
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems
Wiese, Steffen, Kraemer, Frank, Betzl, Norbert, Wald, Dietmar
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Thermal modelling of the emerging multi-chip packages
Monier-Vinard, Eric, Bissuel, Valentin, Murphy, Paul, Daniel, Olivier, Dufrenne, Julien
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package
Nguegang, Eric, Franz, Jochen, Kretschmann, Andre, Sandmaier, Hermann
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Multi-scale viscoplastic modeling of Pb-free Sn3.0Ag0.5Cu solder interconnects
Cuddalorepatta, Gayatri, Dasgupta, Abhijit
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Are current turbulence modeling practices addressing industry's needs for electronics thermal design?
Rodgers, Peter, Eveloy, Valerie
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability
Chaillot, A, Munier, C, Maire, O, Vigier, M, Chastanet, C
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface
Holck, O, Dermitzaki, E, Wunderle, B, Bauer, J, Michel, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
FEM assisted development of a SHM-piezo-package for damage evaluation in airplane components
Roellig, Mike, Schubert, Lars, Lieske, Uwe, Boehme, Bjoern, Frankenstein, Bernd, Meyendorf, Norbert
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Light degradation prediction of high-power light-emitting diode lighting modules
Yen-Fu Su, Shin-Yueh Yang, Wei-Hao Chi, Kuo-Ning Chiang
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation
Corfa, A, Gasse, A, Bernabe, S, Ribot, H
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board
Maia Filho, W C, Brizoux, M, Grivon, A
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding
Crack and damage in low-k BEoL stacks under assembly and CPI aspects
Auersperg, J, Vogel, D, Lehr, M U, Grillberger, M, Michel, B
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
Published in 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2010)
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Conference Proceeding