Wafer back-side polishing system and method for integrated circuit device manufacturing processes
Lin Kuo-Yin, Tsai Teng-Chun, Lin Chang-Sheng, Lien Kuo-Cheng, Liu Wen-Kuei, Lee Shen-Nan, Chou Yu-Wei, Lu Hsin-Hsien
Year of Publication 26.12.2017
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Year of Publication 26.12.2017
Patent
WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES
Lin Kuo-Yin, Tsai Teng-Chun, Lin Chang-Sheng, Lien Kuo-Cheng, Liu Wen-Kuei, Lee Shen-Nan, Chou Yu-Wei, Lu Hsin-Hsien
Year of Publication 04.05.2017
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Year of Publication 04.05.2017
Patent
Wafer back-side polishing system and method for integrated circuit device manufacturing processes
Lin Kuo-Yin, Tsai Teng-Chun, Lin Chang-Sheng, Lien Kuo-Cheng, Liu Wen-Kuei, Lee Shen-Nan, Chou Yu-Wei, Lu Hsin-Hsien
Year of Publication 31.01.2017
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Year of Publication 31.01.2017
Patent