Electromigration-aware routing for 3D ICs with stress-aware EM modeling
Pak, Jiwoo, Lim, Sung Kyu, Pan, David Z.
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
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Conference Proceeding
Modeling of electromigration in through-silicon-via based 3D IC
Jiwoo Pak, Pathak, M., Sung Kyu Lim, Pan, D. Z.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs
Jiwoo Pak, Sung Kyu Lim, Pan, David Z.
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
Published in 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (01.11.2013)
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Conference Proceeding
Robust Clock Tree Synthesis with timing yield optimization for 3D-ICs
Jae-Seok Yang, Jiwoo Pak, Xin Zhao, Sung Kyu Lim, Pan, D Z
Published in 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011) (01.01.2011)
Published in 16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011) (01.01.2011)
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Conference Proceeding
Design for manufacturability and reliability for TSV-based 3D ICs
Pan, D. Z., Sung Kyu Lim, Athikulwongse, K., Moongon Jung, Mitra, J., Jiwoo Pak, Pathak, M., Jae-seok Yang
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
Published in 17th Asia and South Pacific Design Automation Conference (01.01.2012)
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Conference Proceeding