A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives
Zhang, Shuye, Qi, Xiaoquan, Yang, Ming, Cao, Yang, Lin, Tiesong, He, Peng, Paik, Kyung-Wook
Published in Journal of materials science. Materials in electronics (01.05.2019)
Published in Journal of materials science. Materials in electronics (01.05.2019)
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Journal Article
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface
Wang, Shaoan, Chen, Xiangyu, Luo, Keyu, Zhou, Hongzhi, Li, Rongqing, He, Peng, Paik, Kyung-Wook, Zhang, Shuye
Published in Journal of materials research and technology (01.11.2023)
Published in Journal of materials research and technology (01.11.2023)
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Journal Article
Wettability and interfacial morphology of Sn–3.0Ag–0.5Cu solder on electroless nickel plated ZnS transparent ceramic
Zhang, Shuye, Zhu, Bingxuan, Zhou, Xiang, Wang, Xingxing, Lin, Tiesong, He, Peng, Paik, Kyung-Wook
Published in Journal of materials science. Materials in electronics (01.10.2019)
Published in Journal of materials science. Materials in electronics (01.10.2019)
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Journal Article
The preparation of anisotropic conductive paste and its application in FOB interconnection
Cai, Xionghui, Zhai, Aixia, Zhou, Chenglong, Paik, Kyung-Wook
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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Journal Article
The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics
Liu, Jinhong, Jing, Xinyi, Chen, Jieshi, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Electronic materials letters (01.05.2024)
Published in Electronic materials letters (01.05.2024)
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Journal Article
Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads
Zhang, Shuye, Sun, Mingjia, Yang, Jianqun, Li, Xingji, He, Peng, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2023)
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Journal Article
Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications
Park, Jae-Hyeong, Lee, Sang-Mok, Park, Jongcheol, Lee, Hyunjoo Jenny, Paik, Kyung-Wook
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2020)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2020)
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Journal Article
Enhanced Electrical Conductivity of Nanocomposites Containing Hybrid Fillers of Carbon Nanotubes and Carbon Black
Ma, Peng-Cheng, Liu, Ming-Yang, Zhang, Hao, Wang, Sheng-Qi, Wang, Rui, Wang, Kai, Wong, Yiu-Kei, Tang, Ben-Zhong, Hong, Soon-Hyung, Paik, Kyung-Wook, Kim, Jang-Kyo
Published in ACS applied materials & interfaces (27.05.2009)
Published in ACS applied materials & interfaces (27.05.2009)
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Journal Article
Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices
Lee, Tae-Ik, Jo, Woosung, Kim, Wansun, Kim, Ji-Hye, Paik, Kyung-Wook, Kim, Taek-Soo
Published in ACS applied materials & interfaces (10.04.2019)
Published in ACS applied materials & interfaces (10.04.2019)
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Journal Article
Guest editorial: Heterogeneous integration and chiplets interconnection
Zhang, Shuye, Gan, Chong Leong, He, Peng, Paik, Kyung-Wook
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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Journal Article
FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays
Lee, Taemin, Jung, Joontaek, Lee, Sang-Mok, Park, Jongcheol, Park, Jae-Hyeong, Paik, Kyung-Wook, Lee, Hyunjoo J.
Published in Sensors (Basel, Switzerland) (25.07.2022)
Published in Sensors (Basel, Switzerland) (25.07.2022)
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Journal Article
Effect of microwave hybrid susceptors on the interface morphology, mechanical properties and fracture morphology of Cu/nano-Sn-3.0Ag-0.5Cu/Cu joints
Zhang, Shuai, Zhou, Hongzhi, Ding, Tianran, Long, Weimin, Zhong, Sujuan, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Journal of materials research and technology (01.01.2024)
Published in Journal of materials research and technology (01.01.2024)
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Journal Article
A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling
Zhang, Shuye, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2016)
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Journal Article
The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates
Zhang, Shuye, Wang, Shaoan, Zhang, Shang, Chen, Xiangyu, Zeng, Chen, Paik, Kyung-Wook, He, Peng
Published in Journal of materials research and technology (01.11.2023)
Published in Journal of materials research and technology (01.11.2023)
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Journal Article
The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder
Xu, Sunwu, Li, Yifei, Jing, Xinyi, Paik, Kyung-Wook, He, Peng, Zhang, Shuye
Published in Journal of materials research and technology (01.03.2024)
Published in Journal of materials research and technology (01.03.2024)
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Journal Article
Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly
Park, Jae-Hyeong, Park, Jong Cheol, Lee, SeYong, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
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Journal Article
A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications
Zhang, Shuye, Lin, Tiesong, He, Peng, Zhao, Ning, Huang, Mingliang, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2017)
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Journal Article