MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
CABRAL JR CYRIL, RODBELL KENNETH PARKER, BAKER BRETT CAROLINE, HUANG QIANG
Year of Publication 06.12.2010
Get full text
Year of Publication 06.12.2010
Patent
METHOD FOR FORMING A POROUS DIELECTRIC MATERIAL LAYER IN A SEMICONDUCTOR DEVICE AND DEVICE FORMED
HEDRICK JEFFREY CURTIS, RODBELL KENNETH PARKER, ROSENBERG ROBERT, DALTON TIMOTHY JOSEPH, NITTA SATYANARAYANA V, GRECO STEPHEN EDWARD, PURUSHOTHAMAN SAMPATH
Year of Publication 24.06.2002
Get full text
Year of Publication 24.06.2002
Patent
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
CABRAL JR, CYRIL, HUANG, QIANG, RODBELL, KENNETH PARKER, BAKER, BRETT, CAROLINE
Year of Publication 13.07.2016
Get full text
Year of Publication 13.07.2016
Patent
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
CABRAL JR, CYRIL, HUANG, QIANG, RODBELL, KENNETH PARKER, BAKER, BRETT, CAROLINE
Year of Publication 10.11.2010
Get full text
Year of Publication 10.11.2010
Patent
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
CABRAL JR, CYRIL, HUANG, QIANG, RODBELL, KENNETH PARKER, BAKER, BRETT, CAROLINE
Year of Publication 05.11.2009
Get full text
Year of Publication 05.11.2009
Patent
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURE
CABRAL JR, CYRIL, HUANG, QIANG, RODBELL, KENNETH PARKER, BAKER, BRETT, CAROLINE
Year of Publication 20.08.2009
Get full text
Year of Publication 20.08.2009
Patent
ELECTROPLATING INTERCONNECTION STRUCTURE ON INTEGRATED CIRCUIT CHIP
HU CHAO-KUN, HURD JEFFREY LOUIS, ANDRICACOS PANAYOTIS CONSTANTINOU, DELIGIANNI HARIKLIA, RODBELL KENNETH PARKER, DUKOVIC JOHN OWEN, HORKANS WILMA J, WONG KWONG-HON, EDELSTEIN DANIEL CHARLES, UZOH CYPRIAN EMEKA
Year of Publication 16.09.2010
Get full text
Year of Publication 16.09.2010
Patent
Ultra thin, single phase, diffusion barrier for metal conductors
MCFEELY FENTON READ, RODBELL KENNETH PARKER, NOYAN CEVDET ISMAIL, ROSENBERG ROBERT, COHEN STEPHAN ALAN, YURKAS JOHN JACOB
Year of Publication 06.02.2007
Get full text
Year of Publication 06.02.2007
Patent