INTEGRATED CIRCUIT PACKAGES AND METHODS
Lin, Chi-Yen, Kuo, Ting Hao, Huang, Yu-Chih, Chen, Chen-Shien, Chen, Hsu-Hsien
Year of Publication 04.04.2024
Get full text
Year of Publication 04.04.2024
Patent
Die Bonding Pads and Methods of Forming the Same
Cheng, Ming-Da, Lin, Chia-Li, Huang, Yu-Chih, Chen, Chen-Shien, Lu, Wen-Hsiung
Year of Publication 28.09.2023
Get full text
Year of Publication 28.09.2023
Patent
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Lu, Chun-Ti, Liu, Chia-Hung, Huang, Yu-Chih, Tsai, Zheng-Gang, Chen, Shih-Wei, Chang, Chih-Hao, Lin, Po-Chun, Tsai, Hao-Yi, Liu, Chung-Shi
Year of Publication 26.09.2024
Get full text
Year of Publication 26.09.2024
Patent
METHOD OF FABRICATING PACKAGE STRUCTURE
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Kuo, Ting-Ting, Lai, Chi-Hui, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi
Year of Publication 05.09.2024
Get full text
Year of Publication 05.09.2024
Patent
Fingerprint sensor in info structure and formation method
Yu, Chen-Hua, Huang, Yu-Chih, Chen, Yu-Feng, Liu, Chung-Shi, Tsai, Hao-Yi, Chen, Chih-Hua
Year of Publication 29.08.2023
Get full text
Year of Publication 29.08.2023
Patent
Package structure, package-on-package structure and method of fabricating the same
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Kuo, Ting-Ting, Lai, Chi-Hui, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi
Year of Publication 18.06.2024
Get full text
Year of Publication 18.06.2024
Patent
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Tai, Chih-Hsuan, Chiang, Tsung-Hsien, Wu, Ban-Li, Tsai, Hao-Yi, Lin, Po-Chun
Year of Publication 13.06.2024
Get full text
Year of Publication 13.06.2024
Patent
Semiconductor package and manufacturing method thereof
Lu, Chun-Ti, Liu, Chia-Hung, Huang, Yu-Chih, Tsai, Zheng-Gang, Chen, Shih-Wei, Chang, Chih-Hao, Lin, Po-Chun, Tsai, Hao-Yi, Liu, Chung-Shi
Year of Publication 04.06.2024
Get full text
Year of Publication 04.06.2024
Patent
SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi, Chang, Chih-Hao, Lin, Po-Chun
Year of Publication 14.03.2024
Get full text
Year of Publication 14.03.2024
Patent
Package structure and method of forming the same
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Tai, Chih-Hsuan, Chiang, Tsung-Hsien, Wu, Ban-Li, Tsai, Hao-Yi, Lin, Po-Chun
Year of Publication 12.03.2024
Get full text
Year of Publication 12.03.2024
Patent
Semiconductor package and forming method thereof
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi, Chang, Chih-Hao, Lin, Po-Chun
Year of Publication 26.12.2023
Get full text
Year of Publication 26.12.2023
Patent
Manufacturing method of fingerprint sensor
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Kuo, Ting-Ting, Tai, Chih-Hsuan, Tsai, Hao-Yi, Chen, Chih-Hua
Year of Publication 19.12.2023
Get full text
Year of Publication 19.12.2023
Patent
Semiconductor device with multiple polarity groups
Tseng, Ying-Cheng, Huang, Yu-Chih, Kuo, Ting-Ting, Liu, Chiahung, Lai, Chi-Hui, Tai, Chih-Hsuan, Wu, Ban-Li, Tsai, Hao-Yi
Year of Publication 12.12.2023
Get full text
Year of Publication 12.12.2023
Patent
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Tseng, Ying-Cheng, Liu, Chia-Hung, Huang, Yu-Chih, Tai, Chih-Hsuan, Chiang, Tsung-Hsien, Wu, Ban-Li, Tsai, Hao-Yi, Lin, Po-Chun
Year of Publication 07.12.2023
Get full text
Year of Publication 07.12.2023
Patent
Circuit substrate, package structure and method of manufacturing the same
Lu, Chun-Ti, Liu, Chia-Hung, Huang, Yu-Chih, Chen, Shih-Wei, Chang, Chih-Hao, Lin, Po-Chun, Tsai, Hao-Yi
Year of Publication 28.11.2023
Get full text
Year of Publication 28.11.2023
Patent
Package structure and manufacturing method thereof
Chen, Wei-Yu, Huang, Yu-Chih, Tsao, Chih-Chiang, Hsieh, Ching-Hua, Cheng, Chia-Shen, Lin, Hsiu-Jen, Tsai, Yu-Peng, Yu, Jen-Jui, Chen, Chih-Hua
Year of Publication 28.11.2023
Get full text
Year of Publication 28.11.2023
Patent