Interconnect structures for assembly of multi-layer semiconductor devices
Das Rabindra N, Keast Craig L, Warner Keith, Vitale Steven A, Chen Chenson, Gouker Mark A, Yost Donna-Ruth W
Year of Publication 03.10.2017
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Year of Publication 03.10.2017
Patent
Interconnect Structures for Assembly of Multi-Layer Semiconductor Devices
Das Rabindra N, Keast Craig L, Warner Keith, Vitale Steven A, Chen Chenson, Gouker Mark A, Yost Donna-Ruth W
Year of Publication 13.07.2017
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Year of Publication 13.07.2017
Patent
INTERCONNECT STRUCTURES FOR ASSEMBLY OF MULTI-LAYER SEMICONDUCTOR DEVICES
DAS, RABINDRA, N, CHEN, CHENSON, VITALE, STEVEN, A, WARNER, KEITH, KEAST, CRAIG, L, YOST, DONNA-RUTH, W, GOUKER, MARK, A
Year of Publication 18.02.2016
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Year of Publication 18.02.2016
Patent