Three dimensional microelectric packaging
BREGMAN; MARK F, HORTON; RAYMOND R, PALMER; MICHAEL J, NOYAN; ISMAIL C
Year of Publication 09.04.1991
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Year of Publication 09.04.1991
Patent
Electronic substrate multiple location conductor attachment technology
BREGMAN; MARK F, HORTON; RAYMOND R, PALMER; MICHAEL J, LANZETTA; ALPHONSO P, TONG; HO-MING, NOYAN; ISMAIL C
Year of Publication 21.06.1994
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Year of Publication 21.06.1994
Patent
Electro-optical connectors
ROGERS, DENNIS L, TREWHELLA, JEANNINE M, NOYAN, ISMAIL C, COHEN, MITCHELL S, JOHNSON, GLEN W, OPRYSKO, MODEST M, BREGMAN, MARK F, RITTER, MARK B, BREWER, WILLIAM D
Year of Publication 26.11.1997
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Year of Publication 26.11.1997
Patent
Electronic substrate multiple location conductor attachment technology
BREGMAN; MARK F, HORTON; RAYMOND R, PALMER; MICHAEL J, LANZETTA; ALPHONSO P, TONG; HO-MING, NOYAN; ISMAIL C
Year of Publication 03.08.1993
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Year of Publication 03.08.1993
Patent
Method for bonding dielectric mounted conductors to semiconductor chip contact pads
BREGMAN; MARK F, HORTON; RAYMOND R, PALMER; MICHAEL J, LANZETTA; ALPHONSO P, TONG; HO-MING, NOYAN; ISMAIL C
Year of Publication 20.07.1993
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Year of Publication 20.07.1993
Patent
ELECTRONIC SUBSTRATE MULTIPLE LOCATION CONDUCTOR ATTACHMENT TECHNOLOGY
BREGMAN; MARK F, HORTON; RAYMOND R, PALMER; MICHAEL J, LANZETTA; ALPHONSO P, TONG; HO-MING, NOYAN; ISMAIL C
Year of Publication 26.05.1992
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Year of Publication 26.05.1992
Patent
ELECTRO-OPTICAL CONNECTORS
ROGERS, DENNIS L, TREWHELLA, JEANNINE M, NOYAN, ISMAIL C, COHEN, MITCHELL S, JOHNSON, GLEN W, OPRYSKO, MODEST M, BREGMAN, MARK F, RITTER, MARK B, BREWER, WILLIAM D
Year of Publication 10.03.1993
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Year of Publication 10.03.1993
Patent
ELECTRO-OPTICAL CONNECTORS
JOHNSON; GLEN W, COHEN; MITCHELL S, BREGMAN; MARK F, RITTER; MARK B, OPRYSKO; MODEST M, TREWHELLA; JEANINE M, BREWER; WILLIAM D, NOYAN; ISMAIL C, ROGERS; DENNIS L
Year of Publication 03.03.1992
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Year of Publication 03.03.1992
Patent
Electro-optical connectors
ROGERS, DENNIS L, TREWHELLA, JEANNINE M, NOYAN, ISMAIL C, COHEN, MITCHELL S, JOHNSON, GLEN W, OPRYSKO, MODEST M, BREGMAN, MARK F, RITTER, MARK B, BREWER, WILLIAM D
Year of Publication 02.01.1992
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Year of Publication 02.01.1992
Patent
Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
POORE; PAIGE A, BREGMAN; MARK F, REILEY; TIMOTHY C, PALMER; MICHAEL J, KOVAC; CAROLINE A, BICKFORD; HARRY R, MOSKOWITZ; PAUL A
Year of Publication 29.08.1989
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Year of Publication 29.08.1989
Patent
Multilevel integrated circuit packaging structures
LEDERMANN; PETER G, MIERSCH; EKKEHARD F, BREGMAN; MARK F, TSOU; UH-PO E, REILEY; TIMOTHY C, PAGNANI; DAVID P, BICKFORD; HARRY R, GOW, III; JOHN, VILKELIS; WALTER V, OLSON; LEONARD T, CIPOLLA; THOMAS M
Year of Publication 02.07.1991
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Year of Publication 02.07.1991
Patent
Elektro-optische Verbindungen
JOHNSON, GLEN W., YORKTOWN HEIGHTS, N.Y. 10598, US, BREWER, WILLIAM D., W-1000 BERLIN 30, DE, NOYAN, ISMAIL C., PEEKSKILL, N.Y. 10566, US, COHEN, MITCHELL S., OSSINING, N.Y. 10562, US, BREGMAN, MARK F., RIDGEFIELD, CONNECTICUT 06877, US, OPRYSKO, MODEST M., MAHOPAC, N.Y. 10541, US, ROGERS, DENNIS L., CROTON-ON-HUDSON, N.Y. 10520, US, TREWHELLA, JEANNINE M., PEEKSKILL, N.Y. 10566, US, RITTER, MARK B., BROOKFIELD, CONNECTICUT 06804, US
Year of Publication 28.05.1998
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Year of Publication 28.05.1998
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