by CHEN, Wen-Shiush, YANG, Hong-Tzer, HUANG, Hong-Yu
Published in IEEE transactions on power delivery (01.07.2010)

by Chen, Wen-shiush, Yang, Hong-tzer, Huang, Hong-yu
Published in IEEE transactions on dielectrics and electrical insulation (01.04.2008)

by Chen, Wen-Shiush, Hsieh, Ming-Yueh
Published in Ceramics international (01.08.2017)

by Wu, Yu-Chi, Chen, Meng-Jen, Lin, Jin-Yuan, Chen, Wen-Shiush, Huang, Wen-Liang
Published in International journal of numerical modelling (01.03.2013)

by Hsieh, Ming-Yueh, Chen, Wen-Shiush, Hsu, Cheng-Hsing, Wu, Cheng-Hsuan
Published in Journal of Asian Ceramic Societies (02.10.2022)

by Chen, Wen-Shiush, Hsieh, Ming-Yueh, Lin, Jenn-Sen, Hsu, Cheng-Hsing
Published in Microsystem technologies : sensors, actuators, systems integration (01.10.2018)

by Chen, Wen-Shiush, Yu, Cheng-Chi, Hsu, Cheng-Hsing, Tsai, Shang-Hung
Published in Journal of materials science. Materials in electronics (01.05.2017)

by Chen, Wen-Shiush, Yu, Cheng-Chi, Chen, Ja-Hao, Liu, Jen-Chieh, Hsu, Cheng-Hsing, Wang, Yu-Cheng
Published in Ceramics international (01.08.2017)

by Hsu, Cheng-Hsing, Lin, Jenn-Sen, He, Yi-Da, Yang, Shu-Fong, Yang, Pai-Chuan, Chen, Wen-Shiush
Published in Thin solid films (31.05.2011)

by Chen, Wen-Shiush, Tseng, Ching-Fang, Lee, Yi-Mu, Tung, Hsin-Han, Yang, Hong-Tzer, Hsu, Cheng-Hsing
Published in Journal of materials processing technology (01.03.2009)

by Tseng, Ching Fang, Yang, Hsi Wen, Kao, Wen Hua, Hsu, Cheng Hsing, Lee, Ye Mu, Yu, Yi Ting, Lin, Jenn Sen, Yang, Pai Chuan, Chen, Wen Shiush, Lai, Chun Hung
Published in Applied Mechanics and Materials (01.02.2014)

by Tseng, Ching-Fang, Chen, Wen-Shiush, Lee, Chih-Wen
Published in Thin solid films (31.05.2011)