Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, Ho, Paul S.
Published in Journal of materials research (28.04.2012)
Published in Journal of materials research (28.04.2012)
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Journal Article
Characterization of the Viscoelasticity of Molding Compounds in the Time Domain
Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.
Published in Journal of electronic materials (01.04.2010)
Published in Journal of electronic materials (01.04.2010)
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Journal Article
A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model
Son, Bongchan, Chae, Seung-Hyun, Noh, Seungkwon, Lee, KilJae, Kim, Sangdeok
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints
Huang-Lin Chao, Seung-Hyun Chae, Xuefeng Zhang, Kuan-Hsun Lu, Im, J., Ho, P.S.
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
Published in 2006 IEEE International Reliability Physics Symposium Proceedings (01.03.2006)
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Conference Proceeding
Mechanism of void formation in Cu post solder joint under electromigration
Min-Young Kim, Liang-Shan Chen, Seung-Hyun Chae, Choong-Un Kim
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
Yiwei Wang, Seung-Hyun Chae, Dunne, R., Takahashi, Y., Mawatari, K., Steinmann, P., Bonifield, T., Tengfei Jiang, Im, J., Ho, P. S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints
Seung-Hyun Chae, Chao, B., Xuefeng Zhang, Im, J., Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications
Ramanathan, L.N., Lee, T.-Y.T., Jin-Wook Jang, Seung-Hyun Chae, Ho, P.S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
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Conference Proceeding
Semiconducting π-extended porphyrin dimer and its characteristics in OFET and OPVC
Park, Woo Jea, Chae, Seung Hyun, Shin, Jicheol, Choi, Dong Hoon, Lee, Suk Joong
Published in Synthetic metals (01.07.2015)
Published in Synthetic metals (01.07.2015)
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Journal Article
Effective thermally activated delayed fluorescence emitter and its performance in OLED device
Park, Woo Jae, Lee, Yosup, Kim, Jun Yun, Yoon, Dae Wi, Kim, Jinook, Chae, Seung Hyun, Kim, Hyojeong, Lee, Gahyeon, Shim, Sangdeok, Yang, Joong Hwan, Lee, Suk Joong
Published in Synthetic metals (01.11.2015)
Published in Synthetic metals (01.11.2015)
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Journal Article
Dramatic enhancement of carrier mobility via effective secondary structural arrangement resulting from the substituents in a porphyrin transistor
Choi, Soojung, Chae, Seung Hyun, Shin, Jicheol, Kim, Youngmee, Kim, Sung-Jin, Choi, Dong Hoon, Lee, Suk Joong
Published in Chemical communications (Cambridge, England) (11.05.2013)
Published in Chemical communications (Cambridge, England) (11.05.2013)
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Journal Article
Incorporation of various alcohol substituents to a metalloporphyrin platform for dramatic changes in morphologies of microcrystals
Chae, Seung Hyun, Lee, Kyung Yeon, Kim, Sung-Jin, Lee, Suk Joong, Kim, Youngmee
Published in Inorganic chemistry communications (01.07.2016)
Published in Inorganic chemistry communications (01.07.2016)
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Journal Article