Design of highly uniform spool and bar horns for ultrasonic bonding
Sun-Rak Kim, Jae Hak Lee, Yoo, C. D., Jun-Yeob Song, Lee, S. S.
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
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Journal Article
Influence of pad shape on self-alignment in electronic packaging
AHN, Do H, LEE, Jihye, YOO, Choong D, KIM, Yong-Seog
Published in Journal of electronic materials (01.03.2006)
Published in Journal of electronic materials (01.03.2006)
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Journal Article
Soldering method using longitudinal ultrasonic
Kim, J.H., Jihye Lee, Yoo, C.D.
Published in IEEE transactions on components and packaging technologies (01.09.2005)
Published in IEEE transactions on components and packaging technologies (01.09.2005)
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Journal Article
Development of inclined conductive bump (ICB) for flip-chip interconnection
Ah-Young Park, Sun-Rak Kim, Yoo, C. D., Taek-Soo Kim
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
An efficient edge traces technique for 3D interconnection of stack chip
Sun-Rak Kim, Ah-Young Park, Yoo, C. D., Jae Hak Lee, Jun-Yeob Song, Lee, S. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding