Electromigration-aware routing for 3D ICs with stress-aware EM modeling
Pak, Jiwoo, Lim, Sung Kyu, Pan, David Z.
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
Published in 2012 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) (05.11.2012)
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Conference Proceeding
Modeling of electromigration in through-silicon-via based 3D IC
Jiwoo Pak, Pathak, M., Sung Kyu Lim, Pan, D. Z.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Electromigration-aware redundant via insertion
Jiwoo Pak, Yu Bei, Pan, David Z.
Published in The 20th Asia and South Pacific Design Automation Conference (01.01.2015)
Published in The 20th Asia and South Pacific Design Automation Conference (01.01.2015)
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Conference Proceeding
A frequency tunable resonant clock distribution scheme using bond-wire inductor
Woojin Lee, Pak, Jun So, Jiwoo Pak, Chunghyun Ryu, Jongbae Park, Kim, Joungho
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
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Conference Proceeding
Design of a 3-D SiP for T-DMB with Improvement of Sensitivity and Noise Isolation
Jiwoo Pak, Myunghyun Ha, Jaemin Kim, Donghee Kang, Ho Choi, Seyoung Kwon, Keunsoo La, Joungho Kim
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding