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Superconducting Bump Bonds for Quantum Computing Systems

Superconducting Bump Bonds for Quantum Computing Systems

by Buckley, Bob Benjamin, Yao, Zhimin Jamie
Year of Publication 29.06.2023

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Patent

Superconducting bump bonds for quantum computing systems

Superconducting bump bonds for quantum computing systems

by Buckley, Bob Benjamin, Yao, Zhimin Jamie
Year of Publication 07.03.2023

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by HAMILTON, Michael C, GIUSTINA, Marissa, WHITE, Theodore Charles, YAO, Zhimin Jamie, BURKETT, Brian James, NAAMAN, Ofer
Year of Publication 18.07.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by HAMILTON, Michael C, GIUSTINA, Marissa, WHITE, Theodore Charles, YAO, Zhimin Jamie, BURKETT, Brian James, NAAMAN, Ofer
Year of Publication 20.06.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by Yao, Zhimin Jamie, White, Theodore Charles, Naaman, Ofer, Hamilton, Michael C, Burkett, Brian James, Giustina, Marissa
Year of Publication 13.06.2024

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Patent

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

MULTI-LAYER CHIP ARCHITECTURE AND FABRICATION

by Yao, Zhimin Jamie, White, Theodore Charles, Naaman, Ofer, Hamilton, Michael C, Burkett, Brian James, Giustina, Marissa
Year of Publication 13.06.2024

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Patent

High power LEDs with non-polymer material lenses and methods of making the same

High power LEDs with non-polymer material lenses and methods of making the same

by YAO ZHIMIN JAMIE
Year of Publication 12.07.2016

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Patent

HIGH POWER LEDS

HIGH POWER LEDS

by YAO ZHIMIN JAMIE
Year of Publication 21.05.2015

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Patent

Electronic device submounts including substrates with thermally conductive vias

Electronic device submounts including substrates with thermally conductive vias

by YAO ZHIMIN JAMIE
Year of Publication 08.07.2014

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Patent

High voltage wire bond free LEDS

High voltage wire bond free LEDS

by YAO ZHIMIN JAMIE
Year of Publication 17.09.2013

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Patent

High efficiency LEDs

High efficiency LEDs

by YAO ZHIMIN JAMIE
Year of Publication 04.06.2013

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Patent

HIGH EFFICIENCY LEDS

HIGH EFFICIENCY LEDS

by YAO ZHIMIN JAMIE
Year of Publication 11.10.2012

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Patent

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

by YAO ZHIMIN JAMIE
Year of Publication 28.06.2012

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Patent

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

ELECTRONIC DEVICE SUBMOUNTS INCLUDING SUBSTRATES WITH THERMALLY CONDUCTIVE VIAS

by YAO, ZHIMIN JAMIE
Year of Publication 28.06.2012

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Patent

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

by YAO, ZHIMIN, JAMIE
Year of Publication 21.06.2012

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Patent

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

HIGH POWER LEDS WITH NON-POLYMER MATERIAL LENSES AND METHODS OF MAKING THE SAME

by YAO ZHIMIN JAMIE
Year of Publication 21.06.2012

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Patent

HIGH VOLTAGE WIRE BOND FREE LEDS

HIGH VOLTAGE WIRE BOND FREE LEDS

by YAO, ZHIMIN, JAMIE
Year of Publication 19.04.2012

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Patent

HIGH VOLTAGE WIRE BOND FREE LEDS

HIGH VOLTAGE WIRE BOND FREE LEDS

by YAO ZHIMIN JAMIE
Year of Publication 14.04.2011

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Patent

White-emitting LED chips and method for making same

White-emitting LED chips and method for making same

by YAO ZHIMIN JAMIE, IBBETSON JAMES
Year of Publication 11.12.2012

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Patent

Lateral semiconductor Light Emitting Diodes having large area contacts

Lateral semiconductor Light Emitting Diodes having large area contacts

by DONOFRIO MATTHEW, YAO ZHIMIN JAMIE, IBBETSON JAMES
Year of Publication 04.02.2014

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Patent