Showing
1 - 20
results of
61
for search '
"Goh Kim Yong"
'
Skip to content
Portal K.UTB
Čeština
Login
TBU Catalog
e-resources
E-THESES
All Fields
Title
Author
Subject
Find
Advanced Search
Page will reload when a filter is removed.
Reset Filters
Applied Filters:
Topic:
Remove Filter
electricity
Page will reload when a filter is removed.
Reset Filters
Show filters (1)
Topic:
Remove Filter
electricity
Search Results - "Goh Kim Yong"
Showing
1 - 20
results of
61
for search '
"Goh Kim Yong"
'
, query time: 0.99s
Refine Results
Sort
Relevance
Date Descending
Date Ascending
1
Loading…
Semiconductor packages having an electric device with a recess
by
Zhang, Xueren
,
Goh
,
Kim
-
Yong
,
Ma, Yiyi
Year of Publication
19.05.2020
Get full text
Patent
Save to List
Saved in:
2
Loading…
SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
08.02.2018
Get full text
Patent
Save to List
Saved in:
3
Loading…
Semiconductor packages having an electric device with a recess
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
21.11.2017
Get full text
Patent
Save to List
Saved in:
4
Loading…
Ball grid array to pin grid array conversion
by
GOH KIM
-
YONG
Year of Publication
28.01.2014
Get full text
Patent
Save to List
Saved in:
5
Loading…
Multi-stacked semiconductor dice scale package structure and method of manufacturing same
by
GOH KIM
-
YONG
Year of Publication
06.08.2013
Get full text
Patent
Save to List
Saved in:
6
Loading…
BALL GRID ARRAY TO PIN GRID ARRAY CONVERSION
by
GOH KIM
-
YONG
Year of Publication
23.05.2013
Get full text
Patent
Save to List
Saved in:
7
Loading…
Fan-out wafer level package with polymeric layer for high reliability
by
GOH KIM
-
YONG
Year of Publication
07.05.2013
Get full text
Patent
Save to List
Saved in:
8
Loading…
Semiconductor package and method of manufacturing the same
by
GOH KIM
-
YONG
Year of Publication
02.04.2013
Get full text
Patent
Save to List
Saved in:
9
Loading…
Wafer level chip scale package (WLCSP) having edge protection
by
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
21.02.2017
Get full text
Patent
Save to List
Saved in:
10
Loading…
Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of forming
by
Duca Roseanne
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
20.09.2016
Get full text
Patent
Save to List
Saved in:
11
Loading…
LOW COST THERMALLY ENHANCED HYBRID BGA AND METHOD OF MANUFACTURING THE SAME
by
GOH KIM
-
YONG
Year of Publication
05.07.2012
Get full text
Patent
Save to List
Saved in:
12
Loading…
Offset of contact opening for copper pillars in flip chip packages
by
GOH KIM
-
YONG
,
ZHANG XUEREN
Year of Publication
08.07.2014
Get full text
Patent
Save to List
Saved in:
13
Loading…
ELECTRONIC DEVICE INCLUDING COMPONENTS IN COMPONENT RECEIVING CAVITY AND RELATED METHODS
by
WONG WING SHENQ
,
GOH KIM
-
YONG
Year of Publication
19.11.2015
Get full text
Patent
Save to List
Saved in:
14
Loading…
MULTI-STACKED SEMICONDUCTOR DICE SCALE PACKAGE STRUCTURE AND METHOD OF MANUFACTURING SAME
by
GOH KIM
-
YONG
Year of Publication
30.06.2011
Get full text
Patent
Save to List
Saved in:
15
Loading…
FAN-OUT WAFER LEVEL PACKAGE WITH POLYMERIC LAYER FOR HIGH RELIABILITY
by
GOH KIM
-
YONG
Year of Publication
30.06.2011
Get full text
Patent
Save to List
Saved in:
16
Loading…
OFFSET OF CONTACT OPENING FOR COPPER PILLARS IN FLIP CHIP PACKAGES
by
GOH KIM
-
YONG
,
ZHANG XUEREN
Year of Publication
13.06.2013
Get full text
Patent
Save to List
Saved in:
17
Loading…
Integrated circuit device with shaped leads and method of forming the device
by
Goh Wei Zhen
,
Ma Yiyi
,
Goh Kim
-
Yong
,
Zhang Xueren
Year of Publication
13.06.2017
Get full text
Patent
Save to List
Saved in:
18
Loading…
Electronic device with heat dissipater
by
Duca Roseanne
,
Goh Kim
-
Yong
,
Motta Valter
,
Zhang Xueren
Year of Publication
11.04.2017
Get full text
Patent
Save to List
Saved in:
19
Loading…
ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
by
GOH Kim
-
Yong
,
ZHANG Xueren
,
MA Yiyi
Year of Publication
06.10.2016
Get full text
Patent
Save to List
Saved in:
20
Loading…
Window clamp top plate for integrated circuit packaging
by
GOH KIM
-
YONG
,
WONG WINGSHENQ
,
ZHANG XUEREN
Year of Publication
05.08.2014
Get full text
Patent
Save to List
Saved in:
1
2
3
4
Next
[4]
RSS Feed
Email Search
Save Search
Search History
Back
Refine Results
Page will reload when a filter is selected or excluded.
Limit to articles from scholarly journals
Limit to articles with full text available
Limit to Open Access content
Exclude newspaper articles
Include articles at other libraries
Expand results using synonyms
Format
Patent
61 results
61
Subject Area
chemistry
61 results
61
medicine
61 results
61
sciences
61 results
61
physics
2 results
2
Topic
basic electric elements
61 results
61
electric solid state devices not otherwise provided for
61 results
61
electricity
semiconductor devices
61 results
61
casings or constructional details of electric apparatus
6 results
6
electric techniques not otherwise provided for
6 results
6
See more
Language
English
61 results
61
Chinese
8 results
8
French
2 results
2
Year of Publication
From:
To:
Database
esp@cenet
61 results
61