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"Chun-Jung Lin"
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Search Results - "Chun-Jung Lin"
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"Chun-Jung Lin"
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System in Package SiP
by
CHUN JUNG LIN
,
RUEI TING GU
Year of Publication
20.09.2022
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THINNING SYSTEM IN PACKAGE
by
CHUN JUNG LIN
,
RUEI TING GU
Year of Publication
20.09.2022
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MANAGING METHOD OF FRAGMENTARY DIGITAL CREATION AND COMPUTER READABLE STORAGE MEDIUM
by
LIN
,
Chun
-
Jung
Year of Publication
19.01.2023
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Thinning system in package
by
Gu, Ruei Ting
,
Lin
,
Chun Jung
Year of Publication
09.01.2024
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System in package
by
Gu, Ruei Ting
,
Lin
,
Chun Jung
Year of Publication
21.02.2023
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INTEGRATION PACKAGE WITH INSULATING BOARDS
by
LIN
,
CHUN JUNG
,
GU, RUEI TING
Year of Publication
16.11.2023
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WAFER PACKAGE FOR PROTECTION OF ALUMINUM DIE PAD OF DIE FROM DAMAGES DURING PROBE TESTING PROCESS
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
26.09.2024
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CHIP PACKAGE UNIT WITH OUTER PROTECTIVE LAYER AND METHOD OF MANUFACTUIRNG THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
08.08.2024
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EMBEDDED DUAL IN-LINE MEMORY MODULE
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
01.08.2024
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CHIP PACKAGE WITH HEAT DISSIPATION AND ELECTROMAGNETIC PROTECTION
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
18.07.2024
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SYSTEM IN PACKAGE
by
LIN
,
Chun Jung
,
GU, Ruei Ting
Year of Publication
15.09.2022
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THINNING SYSTEM IN PACKAGE
by
LIN
,
Chun Jung
,
GU, Ruei Ting
Year of Publication
15.09.2022
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CHIP PACKAGE WITH METAL SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
16.05.2024
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CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
02.05.2024
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CHIP PACKAGE
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
11.04.2024
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CHIP PACKAGE HAVING DIE PAD WITH PROTECTIVE LAYER
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
21.03.2024
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CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING LAYER AND GROUND WIRE AND METHOD OF MANUFACTURING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
14.03.2024
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CHIP PACKAGE HAVING FOUR SIDES PROVIDED WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYERS AND METHOD OF MANUFACTURING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
22.02.2024
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CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND METHOD OF MANUFACTURING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
08.02.2024
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CHIP PACKAGE UNIT, METHOD OF MANUFACTURING THE SAME, AND PACKAGE STRUCTURE FORMED BY STACKING THE SAME
by
LIN
,
CHUN
-
JUNG
,
GU, RUEI-TING
,
YU, HONGI
Year of Publication
25.01.2024
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