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Year of Publication 13.06.2023
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Structure and Method for Integrated Microphone
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Year of Publication 31.12.2020
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Year of Publication 15.09.2020
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Structure and Method for Integrated Microphone
Peng, Jung-Huei, Huang, Yao-Te, Hung, Li-Min, Cheng, Chun-wen, Cho, Chin-Yi, Chu, Chia-Hua
Year of Publication 04.10.2018
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Year of Publication 04.10.2018
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Method for manufacturing a microphone
Peng, Jung-Huei, Huang, Yao-Te, Hung, Li-Min, Cheng, Chun-wen, Cho, Chin-Yi, Chu, Chia-Hua
Year of Publication 12.06.2018
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Year of Publication 12.06.2018
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Monolithic complementary metal-oxide semiconductor (CMOS)-integrated silicon microphone
Huang Yao-Te, Cho Chin-Yi, Chu Chia-Hua, Cheng Chun-Wen, Peng Jung-Huei
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Year of Publication 04.10.2016
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MONOLITHIC COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) - INTEGRATED SILICON MICROPHONE
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Year of Publication 18.08.2016
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Method and apparatus for a wafer seal ring
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Year of Publication 06.06.2017
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Year of Publication 06.06.2017
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Structure and Method for Integrated Microphone
HUNG LI-MIN, HUANG YAO-TE, CHENG CHUN-WEN, CHO CHIN-YI, PENG JUNG-HUEI, CHU CHIA-HUA
Year of Publication 02.06.2016
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Year of Publication 02.06.2016
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Wafer level packaging techniques
TSAI SHANG-YING, HUNG LI-MIN, TENG YIUAN, HUANG YAO-TE, CHO CHIN-YI, PENG JUNG-HUEI
Year of Publication 23.02.2016
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Year of Publication 23.02.2016
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Structure and method for integrated microphone
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Year of Publication 16.02.2016
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Year of Publication 16.02.2016
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WAFER LEVEL PACKAGING TECHNIQUES
TSAI SHANG-YING, HUNG LI-MIN, TENG YIUAN, HUANG YAO-TE, CHO CHIN-YI, PENG JUNG-HUEI
Year of Publication 07.05.2015
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Year of Publication 07.05.2015
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Systems and methods for post-bonding wafer edge seal
TSAI SHANG-YING, TENG YIUAN, HUANG YAO-TE, HUNG LIN-MIN, CHO CHIN-YI, HUANG HSIN-TING, PENG JUNG-HUEI
Year of Publication 23.09.2014
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Year of Publication 23.09.2014
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Structure and Method for Integrated Microphone
HUNG LI-MIN, HUANG YAO-TE, CHENG CHUN-WEN, CHO CHIN-YI, PENG JUNG-HUEI, CHU CHIA-HUA
Year of Publication 18.09.2014
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Year of Publication 18.09.2014
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SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL
TSAI SHANG-YING, TENG YIUAN, HUANG YAO-TE, HUNG LIN-MIN, CHO CHIN-YI, HUANG HSIN-TING, PENG JUNG-HUEI
Year of Publication 21.08.2014
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Year of Publication 21.08.2014
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Method and Apparatus for a Wafer Seal Ring
TSAI SHANG-YING, HUNG LI-MIN, TENG YIUAN, HUANG YAO-TE, CHO CHIN-YI, HUANG HSIN-TING, PENG JUNG-HUEI
Year of Publication 07.08.2014
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Year of Publication 07.08.2014
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Bonding layer structure and method for wafer to wafer bonding
TSAI SHANG-YING, HUNG LI-MIN, TENG YIUAN, HUANG YAO-TE, CHO CHIN-YI, HUANG HSIN-TING, PENG JUNG-HUEI
Year of Publication 01.04.2014
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Year of Publication 01.04.2014
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Method for forming wafer seal ring
PENG JUNG HUEI, TENG YIUAN, HUANG YAO-TE, HUANG HSIN-TING, TSAI SHANG YING, HUNG LI MIN, CHO CHIN YI
Year of Publication 30.07.2019
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Year of Publication 30.07.2019
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