Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 23.12.2008
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Year of Publication 23.12.2008
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Ferromagnetic liner for conductive lines of magnetic memory cells
GAIDIS MICHAEL C, LEUSCHNER RAINER, RUBINO JUDITH M, ROMANKIW LUBOMYR TARAS
Year of Publication 21.08.2007
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Year of Publication 21.08.2007
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Ferromagnetic liner for conductive lines of magnetic memory cells
GAIDIS MICHAEL C, ROMANKIW LUBOMYR T, LEUSCHNER RAINER, RUBINO JUDITH M
Year of Publication 10.05.2007
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Year of Publication 10.05.2007
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Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.07.2006
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Year of Publication 25.07.2006
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Ferromagnetic liner for conductive lines of magnetic memory cells
GAIDIS MICHAEL C, ROMANKIW LUBOMYR T, LEUSCHNER RAINER, RUBINO JUDITH M
Year of Publication 02.02.2006
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Year of Publication 02.02.2006
Patent
Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 01.12.2005
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Year of Publication 01.12.2005
Patent
METHOD FOR PREPARING A CONDUCTIVE PAD FOR ELECTRICAL CONNECTION AND CONDUCTIVE PAD FORMED
JOHN G. GAUDIELLO, JUDITH M. RUBINO, DANIEL C. EDELSTEIN, CARLOS J. SAMBUCETTI, GEORGE WALKER
Year of Publication 29.07.2005
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Year of Publication 29.07.2005
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Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 25.11.2004
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Year of Publication 25.11.2004
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Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 24.08.2004
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Year of Publication 24.08.2004
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MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS
SMITH SEAN P, RUBINO JUDITH M, KRISHNAN MAHADEVAIYER, CANAPERI DONALD F, FLUEGEL JAMES E, HENRY RICHARD O, RESTAINO DARRYL D
Year of Publication 22.06.2006
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Year of Publication 22.06.2006
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Method for preparing a conductive pad for electrical connection and conductive pad formed
JOHN G GAUDIELLO, JUDITH M RUBINO, CARLOS J SAMBUCETTI, DANIEL C EDELSTEIN, GEORGE WALKER
Year of Publication 11.08.2004
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Year of Publication 11.08.2004
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Method for testing chips on flat solder bumps
GRUBER PETER A, SAMBUCETTI CARLOS J, DATTA MADHAV, RUBINO JUDITH M, WALKER GEORGE F
Year of Publication 06.05.2004
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Year of Publication 06.05.2004
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Method for testing chips on flat solder bumps
GRUBER PETER A, SAMBUCETTI CARLOS J, DATTA MADHAV, RUBINO JUDITH M, WALKER GEORGE F
Year of Publication 02.12.2003
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Year of Publication 02.12.2003
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Manufacturable CoWP metal cap process for copper interconnects
SMITH SEAN P. E, RUBINO JUDITH M, KRISHNAN MAHADEVAIYER, CANAPERI DONALD F, FLUEGEL JAMES E, HENRY RICHARD O, RESTAINO DARRYL D
Year of Publication 07.08.2007
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Year of Publication 07.08.2007
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CHIRAS STEFANIE R, RUBINO JUDITH M, CABRAL, JR. CYRIL, COOPER EMANUEL I, TSAI ROGER Y
Year of Publication 15.05.2007
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Year of Publication 15.05.2007
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CHIRAS STEFANIE R, COOPER EMANUEL, RUBINO JUDITH M, CABRAL, JR. CYRIL, TSAI ROGER Y
Year of Publication 20.03.2007
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Year of Publication 20.03.2007
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Self-aligned corrosion stop for copper C4 and wirebond
STAMPER ANTHONY K, SAMBUCETTI CARLOS J, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 17.04.2003
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Year of Publication 17.04.2003
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Process to increase reliability CuBEOL structures
SEO SOONON, SAMBUCETTI CARLOS J, KRISHNAN MAHADEVAIYER, RUBINO JUDITH M, CHEN XIAOMENG, TORNELLO JAMES A
Year of Publication 07.01.2003
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Year of Publication 07.01.2003
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