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Search Results - "JEON , OSEOB"
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"JEON , OSEOB"
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SEMICONDUCTOR DEVICE ASSEMBLY
by
IM SEUNGWON
,
JEON OSEOB
Year of Publication
24.10.2023
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STRAY INDUCTANCE REDUCTION IN POWER SEMICONDUCTOR DEVICE MODULES
by
JEON OSEOB
,
IM SEUNGWON
,
PAUL ROVEENDRA
,
TEYSSEYRE JEROME
Year of Publication
20.07.2023
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POWER MODULE UTILIZING INJECTABLE CONDUCTIVE COMPONENT FOR DIRECT COOLING
by
Yun, Changsun
,
JEON
,
Oseob
Year of Publication
03.10.2024
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JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
by
YUN, Changsun
,
JEON
,
Oseob
Year of Publication
22.08.2024
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JET IMPINGEMENT HEATSINK FOR HIGH POWER SEMICONDUCTOR DEVICES
by
YUN, Changsun
,
JEON
,
Oseob
Year of Publication
15.08.2024
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Semiconductor device package assemblies with direct leadframe attachment
by
Im, Seungwon
,
Jeon
,
Oseob
Year of Publication
13.02.2024
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SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTACHMENT
by
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
25.07.2024
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Integration of semiconductor device assemblies with thermal dissipation mechanisms
by
Im, Seungwon
,
Jeon
,
Oseob
,
Kang, Dongwook
Year of Publication
16.04.2024
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MOLDED POWER MODULES
by
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
17.01.2024
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MOLDED POWER MODULES
by
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
29.11.2023
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MOLDED POWER MODULES
by
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
09.11.2023
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THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
by
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
19.10.2023
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INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
by
KANG, Dongwook
,
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
22.08.2024
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SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
by
WON, Bosung
,
LEE, Yoonsoo
,
KO, Youngsun
,
JEON
,
Oseob
Year of Publication
15.08.2024
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SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
by
WON, Bosung
,
LEE, Yoonsoo
,
KO, Youngsun
,
JEON
,
Oseob
Year of Publication
08.08.2024
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Semiconductor device package assemblies and methods of manufacture
by
Im, Seungwon
,
Jeon
,
Oseob
,
Kim, Jeungdae
Year of Publication
06.12.2022
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FLUIDIC-CHANNEL COOLED SUBSTRATES
by
KIM, Jihwan
,
KANG, Dongwook
,
JEON
,
Oseob
,
IM, Seungwon
Year of Publication
13.06.2024
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MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
by
KIM, Jihwan
,
KANG, Dongwook
,
JEON
,
Oseob
,
IM, Seungwon
Year of Publication
06.06.2024
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POWER MODULE PACKAGE WITH MOLDED VIA AND DUAL SIDE PRESS-FIT PIN
by
CHI, Heejo
,
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
23.05.2024
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POWER ELECTRONICS PACKAGE WITH DUAL-SINGLE SIDE COOLING WATER JACKET
by
LEE, Yoonsoo
,
IM, Seungwon
,
JEON
,
Oseob
Year of Publication
23.05.2024
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