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Year of Publication 23.01.2024
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MULTI CHIP HARDWARE SECURITY MODULE
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Year of Publication 27.04.2023
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Year of Publication 01.03.2022
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Year of Publication 28.04.2020
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Year of Publication 31.03.2020
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Year of Publication 17.03.2020
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LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
Sikka, Kamal K, Iruvanti, Sushumna, Tunga, Krishna R, Li, Shidong, Weiss, Thomas, Toy, Hilton T
Year of Publication 09.01.2020
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Year of Publication 09.01.2020
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Lid attach optimization to limit electronic package warpage
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Year of Publication 25.06.2019
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Lid attach optimization to limit electronic package warpage
Sikka, Kamal K, Iruvanti, Sushumna, Li, Shidong, Zitz, Jeffrey A, Toy, Hilton T
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Year of Publication 25.09.2018
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LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
WEISS, Thomas, TUNGA, Krishna R, IRUVANTI, Sushumna, LI, Shidong, TOY, Hilton T, SIKKA, Kamal K
Year of Publication 29.08.2019
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Year of Publication 29.08.2019
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