PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS
CHENG MING DA, HSU KUO CHING, LIN WEI HUNG, LII MIRNG JI, CHEN CHEN SHIEN, HUANG HUI MIN
Year of Publication 25.08.2022
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Year of Publication 25.08.2022
Patent
WAFER ETCHING PROCESS AND METHODS THEREOF
CHENG MING DA, LIN WEI HUNG, YEN CHEN EN, LU WEN HSIUNG, HUANG HUI MIN, LIU HSU LUN
Year of Publication 28.07.2021
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Year of Publication 28.07.2021
Patent
3 3D PACKAGE STRUCTURE AND METHODS OF FORMING SAME
CHENG MING DA, KUO HSUAN TING, LIU CHUNG SHI, LIN CHIH WEI, CHEN MENG TSE, HUANG HUI MIN
Year of Publication 09.01.2017
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Year of Publication 09.01.2017
Patent
AN APPARATUS FOR CHARGED PARTICLE LITHOGRAPHY SYSTEM
LIN SHY JAY, CHIEN TSUNG CHIH, SHIN JAW JUNG, WANG SHIH CHI, LIN BURN JENG, HUANG HUI MIN
Year of Publication 24.02.2016
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Year of Publication 24.02.2016
Patent
INTEGRATED FAN-OUT STRUCTURE AND METHOD
CHENG MING DA, LIU CHUNG SHI, YU CHEN HUA, PEI HAO JAN, HUANG HUI MIN, LIN HSIU JEN
Year of Publication 11.05.2016
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Year of Publication 11.05.2016
Patent
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
CHENG MING DA, LIU CHUNG SHI, YU CHEN HUA, TSAI TSAI TSUNG, LIN CHIH WEI, HUANG HUI MIN
Year of Publication 12.02.2016
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Year of Publication 12.02.2016
Patent
METHODS OF PACKAGING SEMICONDUCTOR DEVICES AND PACKAGED SEMICONDUCTOR DEVICES
YU CHEN HUA, LIU CHUNG SHI, CHENG MING DA, HUANG CHIH FAN, CHEN MENG TSE, HUANG HUI MIN
Year of Publication 18.01.2016
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Year of Publication 18.01.2016
Patent
WAFER-LEVEL MOLDING CHASE DESIGN
YU CHEN HUA, LIU CHUNG SHI, CHENG MING DA, HUANG CHIH FAN, JANG BOR PING, HWANG CHIEN LING, HUANG HUI MIN, CHEN MENG TSE
Year of Publication 23.12.2015
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Year of Publication 23.12.2015
Patent
STACKED DIES WITH WIRE BONDS AND METHOD
YU CHEN HUA, CHENG MING DA, LIU CHUNG SHI, YEH SUNG FENG, CHEN MING FA, CHEN MENG TSE, HUANG HUI MIN, LIN HSIU JEN
Year of Publication 09.11.2015
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Year of Publication 09.11.2015
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PACKAGING WITH INTERPOSER FRAME
CHENG MING DA, LIU CHUNG SHI, LIN CHIH WEI, HUANG HUI MIN, CHEN CHEN SHIEN, HU YEN CHANG
Year of Publication 24.02.2014
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Year of Publication 24.02.2014
Patent
PACKAGING WITH INTERPOSER FRAME
CHENG MING DA, LIU CHUNG SHI, LIN CHIH WEI, HUANG HUI MIN, CHEN CHEN SHIEN, HU YEN CHANG
Year of Publication 27.11.2013
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Year of Publication 27.11.2013
Patent
Common source transistor apparatus
CHEN, LEAF, CHU, LING, TSAI, CHUNIEN, HUANG, HUI-MIN, CHANG, CHIEH-PIN
Year of Publication 22.08.2024
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Year of Publication 22.08.2024
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METHOD FOR FORMING A PACKAGE STRUCTURE
HUANG, Hui-Min, HSUEH, Chang-Jung, ZHAN, Kai Jun, LIN, Wei-Hung, CHENG, Ming-Da
Year of Publication 04.07.2024
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Year of Publication 04.07.2024
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Integrated Circuit Packages and Methods of Forming the Same
Cheng, Ming-Da, Yan, Kathy, Hsueh, Chang-Jung, Huang, Hui-Min, Lin, Po-Yao
Year of Publication 18.04.2024
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Year of Publication 18.04.2024
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Apparatus and method for forming a package structure
Cheng, Ming-Da, Hsueh, Chang-Jung, Lin, Wei-Hung, Huang, Hui-Min, Zhan, Kai Jun
Year of Publication 16.04.2024
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Year of Publication 16.04.2024
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SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA AND METHODS FOR PERFORMING THE SAME
Wu, Yi Chen, Cheng, Ming-Da, Lin, Wei-Hung, Huang, Hui-Min, Zhan, Kai Jun
Year of Publication 23.11.2023
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Year of Publication 23.11.2023
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CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
HUANG, Hui-Min, HSUEH, Chang-Jung, LIN, Wei-Hung, LIN, Yung-Sheng, ZHAN, Kai-Jun, CHENG, Ming-Da
Year of Publication 03.10.2024
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Year of Publication 03.10.2024
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