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Search Results - "CHEN, WEN-HSIEN"
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"CHEN, WEN-HSIEN"
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Image sensing module
by
Lee, Shih-Ping
,
Chen
,
Wen
-
Hsien
Year of Publication
09.04.2024
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IMAGE SENSING MODULE
by
Lee, Shih-Ping
,
Chen
,
Wen
-
Hsien
Year of Publication
16.03.2023
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Image sensing module
by
Lee, Shih-Ping
,
Chen
,
Wen
-
Hsien
Year of Publication
24.01.2023
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IMAGE SENSING MODULE
by
Lee, Shih-Ping
,
Chen
,
Wen
-
Hsien
Year of Publication
28.10.2021
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Method of fabricating packaging structure
by
Chen, Shih-Ching
,
Lai, Chieh-Lung
,
Chen
,
Hsien
-
Wen
Year of Publication
03.09.2019
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Package structure and fabrication method thereof
by
Chen, Kuang-Hsin
,
Chiang, Ching-Wen
,
Chen
,
Hsien
-
Wen
Year of Publication
02.04.2019
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Image sensing module
by
CHEN
,
WEN
-
HSIEN
,
LEE, SHIH-PING
Year of Publication
01.11.2021
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METHOD OF FABRICATING PACKAGING STRUCTURE
by
Chen, Shih-Ching
,
Lai, Chieh-Lung
,
Chen
,
Hsien
-
Wen
Year of Publication
16.08.2018
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Electronic package and fabrication method thereof and substrate structure
by
Chen, Kuang-Hsin
,
Chiang, Ching-Wen
,
Chen
,
Hsien
-
Wen
Year of Publication
14.08.2018
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Image sensing module
by
CHEN
,
WEN
-
HSIEN
,
LEE, SHIH-PING
Year of Publication
21.04.2021
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Deposition process control method
by
CHEN
,
WEN
-
HSIEN
,
LEE, SHIH-PING
,
FAN, KUANGIH
Year of Publication
01.11.2022
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Deposition process control method
by
CHEN
,
WEN
-
HSIEN
,
LEE, SHIH-PING
,
FAN, KUANGIH
Year of Publication
21.06.2022
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Method of fabricating electronic package
by
Chen, Kuang-Hsin
,
Chiang, Ching-Wen
,
Chen
,
Hsien
-
Wen
,
Lu, Sheng-Li
Year of Publication
05.02.2019
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ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STRUCTURE
by
Chen Kuang-Hsin
,
Chiang Ching-Wen
,
Chen Hsien
-
Wen
Year of Publication
22.09.2016
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PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME
by
CHEN SHIHING
,
CHEN HSIEN
-
WEN
,
LAI CHIEH-LUNG
Year of Publication
09.06.2016
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SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
by
CHEN HSIEN
-
WEN
,
CHIANG CHING-WEN
,
CHEN KUANG-HSIN
Year of Publication
24.03.2016
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PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
by
CHEN HSIEN
-
WEN
,
CHIANG CHING-WEN
,
CHEN KUANG-HSIN
Year of Publication
03.03.2016
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INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF
by
CHEN HSIEN
-
WEN
,
CHIANG CHING-WEN
,
CHEN KUANG-HSIN
Year of Publication
18.02.2016
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METHOD OF FABRICATING ELECTRONIC PACKAGE
by
Chen Kuang-Hsin
,
Chiang Ching-Wen
,
Lu Sheng-Li
,
Chen Hsien
-
Wen
Year of Publication
08.02.2018
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Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof
by
Huang Hsiao-Chun
,
Chen Shih-Ching
,
Chen Hsien
-
Wen
,
Ma Guang-Hwa
Year of Publication
23.01.2018
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electric solid state devices not otherwise provided for
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