Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy
Choi, Eunmi, Choi, Hee Soo, Kim, Areum, Lee, Seon Jea, Cui, Yinhua, Kwon, Soon hyeong, Kim, Chang Hyun, Hahn, Sang June, Son, Hyungbin, Pyo, Sung Gyu
Published in Metals and materials international (01.11.2013)
Published in Metals and materials international (01.11.2013)
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Journal Article
Effect of pre-cleaning treatment and contact wetting angle in the interface between P-doped Si surfaces and selective solar cell electrodes
Cui, Yinhua, Choi, Eunmi, Kim, Areum, Oh, Leeseul, Lee, Seon Jea, Ryang, Ayeon, Park, Hansoo, Lim, Kyunghee, Pyo, Sung Gyu
Published in Electronic materials letters (01.07.2013)
Published in Electronic materials letters (01.07.2013)
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Journal Article