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STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 23.12.2008
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Year of Publication 23.12.2008
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Reduced electromigration and stressed induced migration of copper wires by surface coating
STAMPER ANTHONY K, HU CHAO-KUN, SAMBUCETTI CARLOS J, RUBINO JUDITH M, ROSENBERG ROBERT
Year of Publication 01.12.2005
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Year of Publication 01.12.2005
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METHOD FOR PREPARING A CONDUCTIVE PAD FOR ELECTRICAL CONNECTION AND CONDUCTIVE PAD FORMED
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Year of Publication 29.07.2005
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Year of Publication 29.07.2005
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Method for preparing a conductive pad for electrical connection and conductive pad formed
JOHN G GAUDIELLO, JUDITH M RUBINO, CARLOS J SAMBUCETTI, DANIEL C EDELSTEIN, GEORGE WALKER
Year of Publication 11.08.2004
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Year of Publication 11.08.2004
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CHIRAS STEFANIE R, RUBINO JUDITH M, CABRAL, JR. CYRIL, COOPER EMANUEL I, TSAI ROGER Y
Year of Publication 15.05.2007
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Year of Publication 15.05.2007
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CHIRAS STEFANIE R, COOPER EMANUEL, RUBINO JUDITH M, CABRAL, JR. CYRIL, TSAI ROGER Y
Year of Publication 20.03.2007
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Year of Publication 20.03.2007
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Method for preparing a conductive pad for electrical connection and conductive pad formed
SAMBUCETTI, CARLOS J, RUBINO, JUDITH M, EDELSTEIN, DANIEL C, WALKER, GEORGE, GAUDIELLO, JOHN G
Year of Publication 01.07.2002
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Year of Publication 01.07.2002
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Manufacturable cowp metal cap process for copper interconnects
CANAPERI, DONALD F, FLUEGEL, JAMES E, RUBINO, JUDITH M, RESTAINO, DARRYL D, KRISHNAN, MAHADEVAIYER, SMITH, SEAN P.E, HENRY, RICHARD O
Year of Publication 21.08.2012
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Year of Publication 21.08.2012
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF CU WIRES BY SURFACE COATING
HU, CHAO-KUN, SAMBUCETTI, CARLOS, J, STAMPER, ANTHONY, K, RUBINO, JUDITH, M, ROSENBERG, ROBERT
Year of Publication 05.06.2002
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Year of Publication 05.06.2002
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A conductive pad for electrical connection of an integrated circuit chip
JOHN G GAUDIELLO, JUDITH M RUBINO, CARLOS J SAMBUCETTI, DANIEL C EDELSTEIN, GEORGE WALKER
Year of Publication 20.02.2002
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Year of Publication 20.02.2002
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Method for forming dual-layer low dielectric barrier for interconnects and device formed
LINIGER, ERIC G, JAHNES, CHRISTOPHER, RYAN, JAMES G, RUBINO, JUDITH M, SAMBUCETTI, CARLOS J.
Year of Publication 11.02.2002
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Year of Publication 11.02.2002
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Method for preparing a conductive pad for electrical connection and conductive pad formed
WALKER GEORGE, SAMBUCETTI CARLOS J, GAUDIELLO JOHN G, RUBINO JUDITH M, EDELSTEIN DANIEL C
Year of Publication 01.01.2002
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Year of Publication 01.01.2002
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CABRAL CYRIL JR, CHIRAS STEFANIE R, RUBINO JUDITH M, COOPER EMANUEL I, TSAI ROGER Y
Year of Publication 16.06.2005
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Year of Publication 16.06.2005
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REDUCED ELECTROMIGRATION AND STRESS INDUCED MIGRATION OF Cu WIRES BY SURFACE COATING
HU, CHAO-KUN, SAMBUCETTI, CARLOS, J, STAMPER, ANTHONY, K, RUBINO, JUDITH, M, ROSENBERG, ROBERT
Year of Publication 01.02.2001
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Year of Publication 01.02.2001
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CABRAL CYRIL JR, CHIRAS STEFANIE R, RUBINO JUDITH M, COOPER EMANUEL I, TSAI ROGER Y
Year of Publication 25.05.2005
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Year of Publication 25.05.2005
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Electroplated CoWP composite structures as copper barrier layers
KELLOCK ANDREW J, DELIGIANNI HARIKLIA, CABRAL CYRIL JR, CHIRAS STEFANIE R, RUBINO JUDITH M, COOPER EMANUEL I, TSAI ROGER Y
Year of Publication 19.05.2005
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Year of Publication 19.05.2005
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METHOD FOR FORMING DUAL-LAYER LOW DIELECTRIC BARRIER FOR INTERCONNECTS AND DEVICE FORMED
ERIC G LINIGER, CHRISTOPHER JAHNES, FRANK CARDONE, SAMPATH PURUSHOTHAMAN, JOHN ANTHONY FITZSIMMONS, JUDITH M RUBINO, JAMES GARDNER RYAN, STEPHEN MCCONNELL GATES, CARLOS J SAMBUCETTI
Year of Publication 26.03.2004
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Year of Publication 26.03.2004
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Electroplated cowp composite structures as copper barrier layers
CHIRAS, STEFANIE R, RUBINO, JUDITH M, COOPER, EMANUEL ISRAEL, CABRAL, JR, KELLOCK, ANDREW, DELIGIANNI, HARIKLIA, TSAI, ROGER Y
Year of Publication 21.06.2010
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Year of Publication 21.06.2010
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