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Year of Publication 05.06.2018
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METHOD FOR DEPOSITING A DIFFUSION BARRIER LAYER AND A METAL CONDUCTIVE LAYER
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Year of Publication 03.11.2016
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Method for depositing a diffusion barrier layer and a metal conductive layer
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Year of Publication 12.07.2016
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Year of Publication 02.08.2011
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Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features
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Year of Publication 07.10.2010
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Year of Publication 14.09.2010
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Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate
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Year of Publication 29.10.2009
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Year of Publication 15.09.2009
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Year of Publication 30.03.2010
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Method of depositing a sculptured copper seed layer
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Year of Publication 10.07.2008
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Year of Publication 02.08.2007
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Method of depositing a diffusion barrier layer which provides an improved interconnect
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Year of Publication 26.02.2009
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Method of depositing a metal seed layer on semiconductor substrates
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Year of Publication 25.01.2007
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Method of depositing a metal seed layer on semiconductor substrates
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Year of Publication 18.10.2007
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